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Z-PIN enhanced honeycomb sandwich plate and moulding process thereof

A Z-PIN, 1.Z-PIN technology, applied to other household appliances, household appliances, flat products, etc., to achieve uniform mechanical properties, ensure implant depth, and reduce implant resistance

Active Publication Date: 2019-10-08
ZHUZHOU TIMES NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] How to use Z-PIN technology to make the mechanical properties of the honeycomb sandwich panel skin more uniform, and then improve the overall mechanical properties of the sandwich panel, the prior art does not involve

Method used

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  • Z-PIN enhanced honeycomb sandwich plate and moulding process thereof

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Embodiment Construction

[0033] Combine below figure 1 Embodiments of the present invention are described in detail.

[0034] Z-PIN reinforced honeycomb sandwich panel, including a honeycomb core 1 filled with foam and a skin 2 cured and bonded to the upper and lower surfaces of the honeycomb core 1, characterized in that Z-PIN is implanted in the skin 2 The needle 3, the Z-PIN needle 3 penetrates the skin 2 and is inserted into the foam of the honeycomb core 1 .

[0035] In the Z-PIN reinforced honeycomb sandwich panel shown in the figure, the Z-PIN needle 3 is implanted into the foam of the skin 2 and the honeycomb core 1, which not only increases the reinforcement of the skin 2, but also strengthens the foam surface of the honeycomb core. Reinforcement is carried out to improve the compressive performance of the foam sandwich. When the skin is cured, the foam core can withstand greater curing pressure, improve the curing effect of the skin, and make the mechanical properties of the skin more unifo...

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Abstract

The invention discloses a Z-PIN enhanced honeycomb sandwich plate. The Z-PIN enhanced honeycomb sandwich plate comprises a honeycomb core which is filled with foam and envelopes which are cured and bonded to the upper surface and the lower surface of the honeycomb core; the Z-PIN enhanced honeycomb sandwich plate is characterized in that Z-PIN pins are planted into the envelopes; and the Z-PIN pins penetrate through the envelopes and are inserted into the foam of the honeycomb core. According to the Z-PIN enhanced honeycomb sandwich plate, the envelopes are enhanced, and the foam surface of the honeycomb core is also enhanced, so that the compressive property of the foam sandwich is improved; the foam sandwich can bear greater curing pressure when the envelopes are cured; the curing effectof the envelopes is improved; the mechanical properties of the envelopes is more uniform; the mechanical properties of the upper envelope and the lower envelope of the honeycomb sandwich plate are consistent; the envelopes and the honeycomb core are connected in a reinforced manner, so that the connecting performance of the envelopes and the honeycomb core is enhanced; the overall structural strength and the mechanical properties of the honeycomb sandwich plate are improved; the planting depth of the Z-PIN pins is ensured; and the planting effectiveness of the Z-PINs is improved. The invention also provides a moulding process for the Z-PIN enhanced honeycomb sandwich plate.

Description

technical field [0001] The invention relates to a Z-PIN reinforced honeycomb sandwich panel and a molding process thereof, belonging to the technical field of honeycomb sandwich panel production. Background technique [0002] Due to its high strength, flame retardancy, high temperature resistance, and low dielectric properties, aramid honeycomb sandwich panels can be used in various parts of aircraft, such as radomes, wings, horizontal stabilizers, and vertical stabilizers. In the process of aramid honeycomb molding, due to the existence of the sandwich core, the curing pressure is low, the panel pressure distribution is uneven when under pressure, and the mechanical properties of the upper and lower panels are uneven, which will inevitably affect the performance of the overall sandwich structure. In order to increase the stiffness and strength of the foam core sandwich structure, in recent years, foreign scholars have proposed some concepts and technologies for strengthenin...

Claims

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Application Information

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IPC IPC(8): B29C70/68B29L7/00B29L9/00
CPCB29C70/681B29C70/686B29L2007/002B29L2009/00
Inventor 贾金荣吴东森李赛裴海帆刘含茂程海涛
Owner ZHUZHOU TIMES NEW MATERIALS TECH
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