A heat dissipation film and a display device
A technology of heat dissipation film and display module, which is applied to film/sheet adhesives, electric solid devices, semiconductor devices, etc., can solve the problems of failure of heavy work repair, easy damage to OLEDPanel body, difficult tearing operation, etc. The effect of improving the success rate and reducing the loss of product scrap
Active Publication Date: 2021-10-22
BOE TECH GRP CO LTD +1
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Problems solved by technology
When removing SCF Tape, it is usually removed directly at room temperature or under heating. Since the adhesion between SCF Tape and Panel is usually very strong, it is difficult to remove the OLED Panel, and it is very easy to damage the OLED Panel body, thereby Result in rework repair failure
Method used
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[0020] The heat dissipation film (SCF Tape) attachment process is a necessary process in the production process of OLED panel mobile phones or other electronic products. The role of heat dissipation film in OLED panel module products mainly includes: heat dissipation, OLED Panel will generate heat when it is working, and heat dissipation film can help the heat generated by Panel to dissipate quickly; block external (background) light to avoid affecting the front of the Panel Display effect; the structure enhances the protective effect to avoid damage to the Panel caused by foreign objects or external forces.
[0021] In order to reduce production costs, pursue the maximum utilization of module materials (including Panel), and promote lean production management, the defective products of the heat dissipation film attachment process (such as SCF Tape attachment offset, attachment folds, attachment of foreign objects, attachment Defective products such as bubbles) can be reworked...
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Abstract
The invention relates to the field of display technology, and discloses a heat dissipation film and a display device. Wherein, the heat dissipation film includes an adhesive layer for pasting the heat dissipation film on other structures, and the adhesive layer includes a foaming agent. The above-mentioned heat dissipation film is compounded with a foaming agent in the adhesive layer. After heating, the foaming agent in the adhesive layer can foam and expand, which can quickly reduce the viscosity of the adhesive layer, so that the heat dissipation film can be easily and effectively Remove it from the structure it is attached to (such as an OLED panel) and avoid damage to the structure it is attached to (such as an OLED panel). Therefore, when the heat dissipation film is applied to a specific product, when there is poor adhesion It can facilitate the rework repair of the product, and improve the success rate of rework repair for the heat dissipation film attached to the defective product; Reduce the loss of product scrapping to a large extent.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a heat dissipation film and a display device. Background technique [0002] During the production process of OLED module products, it is usually necessary to attach a heat dissipation film (SCFTape) on the back of the OLED panel (Panel). It will lead to a certain proportion of defective products. In order to reduce production costs and pursue lean production management, these defective products can be reworked and repaired (Rework). When the defective products produced after the existing SCF Tape assembly process are reworked and repaired, the SCF Tape of the defective products needs to be removed first. When removing SCF Tape, it is usually removed directly at room temperature or under heating. Since the adhesion between SCF Tape and Panel is usually very strong, it is difficult to remove the OLED Panel, and it is very easy to damage the OLED Panel body, thereby Resulting in ...
Claims
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IPC IPC(8): C09J7/30C09J11/00C09J7/29H01L51/52
CPCC09J7/30C09J11/00C09J7/29C09J2400/163C09J2433/00C09J2483/00C09J2301/122C09J2301/502H10K50/87
Inventor 付超
Owner BOE TECH GRP CO LTD