Wafer sealing ring, wafer electroplating rack and method for holding wafer in wet process
A technology of electroplating hangers and sealing rings, applied in sealing devices, electrolysis processes, circuits, etc., can solve the problems of wafer tilt, affecting normal wafer transfer, wafer fragments, etc., and achieve the effect of convenient removal
Active Publication Date: 2021-03-05
上海戴丰科技有限公司
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
After the wafer processing is completed, the wafer needs to be taken out from the sealing ring. Since the surface of the wafer and the sealing surface of the sealing ring are relatively smooth, there is relatively strong adhesion between the two, so that an excessive amount of The ejection force of the wafer can also easily cause the tilt of the wafer, affect the normal transfer of the wafer, and even cause wafer fragments
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0035] Such as Figure 1-3 As shown, one embodiment of the present invention is: a wafer sealing ring, which is used to form a seal with the edge of the wafer surface, including an annular sealing base 11 and an annular electrode piece 12, and the annular electrode piece 12 is embedded in the annular sealing base 11 , on the sealing surface 111 of the annular sealing base 11 are provided a plurality of outwardly protruding protrusions 112 .
[0036] The beneficial...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| height | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a wafer sealing ring, a wafer electroplating hanger and a wafer carrying method in a wet process. The wafer sealing ring includes an annular sealing base and an annular electrode sheet, the annular electrode sheet is embedded in the annular sealing base, and a plurality of outwardly protruding protrusions are provided on the sealing surface of the annular sealing base. Compared with the prior art, the protrusion shrinks and deforms after being pressed, and an effective seal is formed between the wafer and the sealing surface; after the compressive force on the wafer is released, the protrusion recovers to its original state by its own elastic force. Shape, and the wafer is lifted from the sealing surface of the annular sealing base, the wafer is no longer subject to the adhesive force of the sealing surface, which greatly facilitates the removal of the wafer and realizes the stable and reliable transfer of the wafer.
Description
technical field [0001] The invention relates to the technical field of wafer packaging wet process, in particular to a wafer sealing ring, a wafer electroplating hanger, and a wafer carrying method in the wet process. Background technique [0002] In the wet process of wafer packaging, only the front side of the wafer needs to be processed, and generally the peripheral part of the wafer needs to be sealed by an annular sealing ring to prevent the solution from penetrating into the back side of the wafer. After the wafer processing is completed, the wafer needs to be taken out from the sealing ring. Since the surface of the wafer and the sealing surface of the sealing ring are relatively smooth, there is relatively strong adhesion between the two, so that an excessive amount of The ejection force of the wafer can also easily cause the tilt of the wafer, affect the normal transfer of the wafer, and even cause wafer fragments. Contents of the invention [0003] In order to o...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D5/02C25D7/12C25D17/08
CPCC25D5/028C25D7/12C25D17/001C25D17/004C25D17/08
Inventor 何志刚
Owner 上海戴丰科技有限公司