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A method for cutting the laser grounding point of a rigid-flex board

A soft-rigid combination board and cutting method technology, applied in the directions of printed circuits, electrical components, printed circuit manufacturing, etc., can solve problems such as poor infiltration and plating, and achieve the effects of high production efficiency, improved product quality, and simple process

Active Publication Date: 2021-06-22
NINGBO HUAYUAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method also adopts the laser process of uncovering the cover, and there will also be the problem of poor penetration and plating.

Method used

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  • A method for cutting the laser grounding point of a rigid-flex board
  • A method for cutting the laser grounding point of a rigid-flex board
  • A method for cutting the laser grounding point of a rigid-flex board

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0021] A method for cutting a laser grounding point of a rigid-flex board, the specific steps are:

[0022] 1) Paste the covering film on the inner soft board of the prepared circuit;

[0023] 2) Paste the hard board substrate on the cover film and press it;

[0024] 3) Grooves are opened on the base material of the hard board to expose the covering film of the inner layer to form a soft and hard board;

[0025] 4) Use a laser to perform grounding and window opening on the cover film, so that the grounding point leaks out in the soft board area: use a laser to cut the inner and outer ring graphics, in which the inner ring is cut through, and the outermost ring is lasered to reduce the energy so that it does not cut It is transparent, and a layer of AD glue is coated on the outermost circle to resist the attack of nickel-palladium-gold potion...

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Abstract

A method for cutting the laser grounding point of a flexible and rigid board, the steps: 1) paste a covering film on the inner flexible board of the prepared circuit; 2) paste the hard board base material on the covering film and press it; 3) Slots are opened on the base material of the board and the inner cover film is exposed to form a soft-hard combination board; 4) The cover film is grounded and opened with a laser to make the grounding point leak out in the soft board area: the inner and outer ring graphics are cut with a laser, Among them, the inner ring is cut through, while the outermost ring is not cut through, and a layer of AD glue that can resist the attack of nickel-palladium-gold potion and avoid plating is coated on the outermost ring. The invention has simple process and high production efficiency, can effectively improve the problem of seepage at the grounding point in the surface treatment process of the product, and improve product quality.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for cutting laser grounding points of a rigid-flex board. Background technique [0002] With the continuous advancement of technology, the functional requirements of electronic products are getting higher and higher. At the same time, the appearance is also very short, small, light and thin. For this reason, more and more circuit boards with multi-layer integrated functions are used, especially It is the combination of soft and hard boards that has developed rapidly in recent years. In the preparation process of the flexible and rigid board, it is necessary to leak the silver foil grounding point in the soft board area according to the circuit design. The traditional method is to use the process of drilling the cover film first and then sticking the tape (such as figure 1 ), but this method has low production efficiency and high cost. At present, the l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/107
Inventor 张成立徐光龙王强
Owner NINGBO HUAYUAN ELECTRONICS TECH