Cutting method for laser grounding point of flexible and rigid combination board
A technology of flexible and rigid boards and cutting methods, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as poor penetration and plating, achieve high production efficiency, avoid penetration plating, and improve ground point penetration problems. Effect
Active Publication Date: 2019-10-11
NINGBO HUAYUAN ELECTRONICS TECH
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Problems solved by technology
This method also adopts the laser process of uncovering the cover, and there will also be the problem of poor penetration and plating.
Method used
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[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0021] A method for cutting a laser grounding point of a rigid-flex board, the specific steps are:
[0022] 1) Paste the covering film on the inner soft board of the prepared circuit;
[0023] 2) Paste the hard board substrate on the cover film and press it;
[0024] 3) Grooves are opened on the base material of the hard board to expose the covering film of the inner layer to form a soft and hard board;
[0025] 4) Use a laser to perform grounding and window opening on the cover film, so that the grounding point leaks out in the soft board area: use a laser to cut the graphics of the inner and outer circles, and the inner circle is cut through, and the outermost circle is lasered to reduce the energy so that it does not cut It is transparent, and a layer of AD glue is coated on the outermost circle to resist the attack of nickel-palladium-go...
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Disclosed is a cutting method for a laser grounding point of a flexible and rigid combination board; the method comprises the following steps of 1) pasting a covering film on an inner flexible board of a manufactured circuit; 2) laminating a rigid board base material on the covering film; 3) forming a groove position in the rigid board base material and exposing the covering film of the inner layer to form a flexible and rigid combination board; and 4) conducting grounding windowing processing on the covering film by laser, so that a grounding point is exposed from the flexible board area, wherein the inner ring pattern and the outer ring pattern are cut by laser, the inner ring is cut completely, the outermost ring is not cut completely, and the outermost ring is coated with an AD adhesive which can resist attack of nickel-palladium gold drug water and can prevent infiltration. The method disclosed by the invention is simple in process, high in production efficiency and capable of effectively improving the grounding point infiltration plating problem in the surface treatment and manufacturing process of the product, and improving the product quality.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for cutting laser grounding points of a rigid-flex board. Background technique [0002] With the continuous advancement of technology, the functional requirements of electronic products are getting higher and higher. At the same time, the appearance is also very short, small, light and thin. For this reason, more and more circuit boards with multi-layer integrated functions are used, especially It is the combination of soft and hard boards that has developed rapidly in recent years. In the preparation process of the flexible and rigid board, it is necessary to leak the silver foil grounding point in the soft board area according to the circuit design. The traditional method is to use the process of drilling the cover film first and then sticking the tape (such as figure 1 ), but this method has low production efficiency and high cost. At present, the l...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/107
Inventor 张成立徐光龙王强
Owner NINGBO HUAYUAN ELECTRONICS TECH