Test seat for surface-mount device

Abstract

The invention provides a test seat which is arranged on a circuit board and sandwiches a surface-mount device (SMD) for radio frequency fine tune (RFZ Finn Tune). The test seat comprises two spaced conductive members and an insulating shell. When in use, the two conductive members of the present invention are soldered to the circuit board, and then the surface-mount device is sandwiched between sandwiching portions of the two conductive members, so that the surface-mount device can be electrically connected to the circuit board to perform radio frequency fine tune (RFZ Finn Tune). The surfacemount device is combined by the clamping method, so it is convenient to replace the surface mounting device in the present invention, and when the surface mount device is replaced, there is no need tounsolder the circuit board and replace the test seat of the present invention, thereby greatly improving the efficiency of fine tune, avoiding repeated soldering and unsoldering of the circuit board,and preventing damages to the circuit board or influences on the characteristics of the circuit board and subsequent distortion of the RF fine tune results.

Description

technical field [0001] The invention relates to a device which is arranged on a circuit board and is installed on a surface-mount device (SMD, surface-mount device) for radio frequency fine tuning (Radio Frequency Fine Tune). Background technique [0002] In the prior art, when radio frequency trimming is performed, radio frequency components (RF components) and surface mount components (R, L, C) are placed on the circuit board for testing, and during the radio frequency trimming process, different surface mount components need to be replaced continuously. components to be adjusted repeatedly; and because the surface mount components are quite small, the pins of the surface mount components need to be soldered to the circuit board before testing to ensure the conduction between the surface mount components and the circuit board; Continuously solder surface mount components on the circuit board, then desolder them and then solder another surface mount component, and such a pr...

AI Technical Summary

Problems solved by technology

[0003] First, the surface mount components are specifically soldered on the match pads on the circuit board, and repeated soldering and desoldering may cause the matching pads to fall off the circuit board, causing damage to the circuit board and requiring replace circuit board

[0004] Second, repeated soldering and desoldering is equivalent to repeated heating of the circuit board, which may affect the characteristics of the circuit board, such as changing the dielectric coefficient of the board, so that the results of RF trimming may not be accurate

[0005] Third, when the surface mount component is soldered on the circuit board, if one of the pins of the surface mount component is to be grounded, it is very difficult for the pin to be grounded to be successfully soldered to the circuit board, so the pin needs to be carefully checked; therefore , RF trimming requires replacement of multiple surface mount components, which can be time consuming

[0006] Therefore, in the prior art, the combination of surface mount components and circuit boards needs to be improved during radio frequency trimming.

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