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Semiconductor device, chip-like semiconductor element, electronic device equipped with semiconductor device, and semiconductor device manufacturing method
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A semiconductor, sheet-like technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., which can solve the problems of narrowing spacing and long time
Inactive Publication Date: 2019-10-25
SONY SEMICON SOLUTIONS CORP
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Therefore, there is a limit to reducing pitch when using seals via capillary underfill systems
In addition, the sealing process of the capillary underfill system takes a relatively long time and also requires a process such as cleaning flux, so there is a difficulty in reducing the takt time in the production process in the mounting system using the capillary underfill system. The problem of increasing productivity
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no. 2 example
[0064] 4. The third embodiment
no. 6 example
[0068] 8. The seventh embodiment
[0069] 9. Eighth embodiment
[0070] 10. Ninth Embodiment
[0071] 11. Tenth embodiment
[0072] 12. Eleventh embodiment
[0073] 13. Twelfth embodiment
[0074] 14. Other
[0075] [Overall Description of Semiconductor Device, Chip-Shaped Semiconductor Element, Electronic Equipment Provided with Semiconductor Device, and Method of Manufacturing Semiconductor Device According to the Present Disclosure]
[0076] In the semiconductor device according to the present disclosure, the semiconductor device used in the electronic equipment according to the present disclosure, and the semiconductor device manufactured by the method of manufacturing a semiconductor device according to the present disclosure (hereinafter, they are sometimes simply referred to as the semiconductor device of the present disclosure) Alternatively, the chip-shaped semiconductor element may include a protrusion formed such that the tip does not reach the wiring board in ...
no. 3 example
[0139] The third embodiment also relates to the chip-shaped semiconductor element according to the first aspect of the present disclosure. In the second embodiment, the protrusions are arranged at a constant density in the area where the protrusions are arranged. On the other hand, in the third embodiment, protrusions are provided at different densities according to positions in the region.
[0140] Figure 10 is a schematic plan view for explaining the structure of the chip-like semiconductor element according to the third embodiment.
[0141] In the third embodiment, solder bumps 11 are continuously arranged along each side of the outer circumference of chip-like semiconductor element 10 , and protrusions 12 are provided in regions where protrusions are arranged on the surface of chip-like semiconductor element 10 .
[0142] However, in the third embodiment, the area surrounded by the solder bump 11 is divided into a plurality of blocks. Then, gaps 13 are provided between...
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Abstract
A semiconductor device is formed by a wiring substrate and a chip-like semiconductor element mounted on the wiring substrate in a flip-chip manner. The surface of the chip-like semiconductor element on the opposing side to the wiring substrate is provided with a plurality of solder bumps and a plurality of projections formed of an insulating material. The chip-like semiconductor element is disposed so as to face the wiring substrate with an under-filling material interposed therebetween, said under-filling material having a characteristic that the viscosity decreases with temperature rise andbeing coated on the wiring substrate. After that, the chip-like semiconductor element undergoes a reflow process, thereby being mounted on the wiring substrate in a flip-chip manner.
Description
technical field [0001] The present technology relates to a semiconductor device, a chip-shaped semiconductor element, electronic equipment provided with the semiconductor device, and a method of manufacturing the semiconductor device. Background technique [0002] Along with miniaturization and thinning of electronic equipment, miniaturization and thinning of packages including chip-shaped semiconductor elements having many terminals are also required. Therefore, there has been proposed a flip-chip mounting system that connects a chip-shaped semiconductor element (hereinafter sometimes simply referred to as a chip) to a wiring board such as an interposer board by using solder bumps or the like. [0003] First, a mounting system using a so-called capillary underfill system in which a chip and a wiring board are electrically connected, and then a liquid-like underfill material is applied to the periphery of the chip, and the underfill material is allowed to penetrate into the ...
Claims
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