Bonding pressing plate, bonding method and packaging body
A package and bonding technology, which is applied in the field of bonding method, package and bonding platen, can solve the problems of non-bonding device damage, poor solder joints of pins, etc., and achieve the effect of preventing contact damage
Inactive Publication Date: 2019-11-01
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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Problems solved by technology
[0004] Aiming at the technical problems of poor solder joints of some pins and easy damage to non-bonding devices caused by the above-mentioned pressing plate, the present application provides a bonding pressing plate, which includes at least one bonding hole, which runs through the bonding The upper and lower surfaces of the bonding plate are used to expose the area to be bonded of the device; at least one accommodating hole is used to accommodate the device body that does not require a bonding process; a pin pressing part, the pin pressing part isolates the accommodating hole from the bonding hole
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[0024] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.
[0025] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. Unless otherwise defined, the technical terms or scientific terms used in the present application shall have the common meanings understood by those skilled in the art to which the present invention belongs. Words such as "one" or "o...
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The invention provides a bonding pressing plate, a bonding process method and a packaging body, so as to electrically connect two device main bodies. A first element is accommodated in an accommodating hole with the surface requiring no bonding process, and a second element is accommodated in a bonding hole as the surface needs to adopt a bonding process method to be bonded with the pin of the first element; a pin abutting and pressing part between the accommodating hole and the bonding hole of the bonding pressing plate can flatly and completely press the first element to be electrically connected with the pin of the second element main body, and warpage caused by other processes before the bonding process and poor welding can be prevented from happening to the pin; and the first elementmain body accommodated in the accommodating hole does not need to be exposed in the bonding process, and touch injuries caused by tools used in the bonding process can be effectively prevented.
Description
technical field [0001] The present application relates to the technical field of semiconductors, in particular to a bonding press plate, a bonding method and a packaging body. Background technique [0002] In the process of semiconductor packaging, in order to electrically connect the pads on the chip with the substrate (or lead frame), a wire bonding process is usually used. Wire bonding technology can be divided into ultrasonic bonding, thermocompression bonding and thermosonic bonding according to the characteristics of the bonding process. [0003] In the existing bonding process, when two devices are electrically connected, due to other installation processes (such as patch mounting, etc.) before the bonding process, the lead frame is likely to be uneven. The design does not adequately press fit the lead frame, causing some pins of the lead frame to warp and lead to failure of poor solder joints. Moreover, the bonding operation opening window of the existing bonding p...
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IPC IPC(8): H01L21/60
CPCH01L24/85H01L2224/85001
Inventor 周正勇
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH