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Deposition mask and method of manufacturing deposition mask

A technology of evaporation mask and manufacturing method, which is applied in the directions of vacuum evaporation plating, sputtering plating, ion implantation plating, etc., and can solve problems such as blurred boundaries

Active Publication Date: 2019-11-12
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if light scattering occurs in the portion defining the outline of the evaporation mask, the boundary between the area of ​​the evaporation mask and other areas will become blurred in the image.

Method used

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  • Deposition mask and method of manufacturing deposition mask
  • Deposition mask and method of manufacturing deposition mask
  • Deposition mask and method of manufacturing deposition mask

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0187] First, a metal plate 64 having a thickness of 25 μm was prepared. Next, the above-mentioned processing steps are performed to form a plurality of through-holes 25 constituted by the first concave portion 30 and the second concave portion 35 in the metal plate 64 . Moreover, the 2nd recessed part 35 which reaches the 1st surface 64a is formed in the part corresponding to the long side surface 26 among the 2nd surface 64b of the metal plate 64. As shown in FIG. exist Figure 27 The observation result of the section of the long side 26 is shown in . In addition, in Figure 28A shows that viewed from the side of the first surface 20a has Figure 27 The long sides 26 shown in the evaporation mask 20 result in the Figure 28B shows the results observed from the second surface 20b side.

[0188] Such as Figure 28B As shown, when the vapor deposition mask 20 is observed from the second surface 20b side, the first portion 261 is visually confirmed. On the other hand, whe...

Embodiment 2

[0190] First, a metal plate 64 having a thickness of 30 μm was prepared. Next, the above-mentioned processing steps are performed to form a plurality of through-holes 25 constituted by the first concave portion 30 and the second concave portion 35 in the metal plate 64 . In addition, the first recess 30 is formed on the first surface 64a of the metal plate 64 corresponding to the long side 26, and the second recess 30 communicated with the first recess 30 is formed on the second surface 64b corresponding to the long side 26. Recess 35 . exist Figure 29A The observation result of the section of the long side 26 is shown in . The long side 26 includes: a first portion 261 formed of a part of the second recess 35 ; and a second portion 262 formed of a part of the first recess 30 .

[0191] Figure 29B will be Figure 29A An enlarged cross-sectional view of the second portion 262 of the long side 26 of FIG. The distance δ between the first end portion 261a and the first con...

Embodiment 3

[0194] The vapor deposition mask 20 was produced in the same manner as in the above-mentioned Example 1, except that the metal plate 64 having a thickness of 15 μm was used. exist Figure 30 The observation result of the section of the long side 26 is shown in . Such as Figure 27 As shown, in the present embodiment, as in the case of the first embodiment, the first portion 261 formed of a curved surface that is curved to be concave inward extends from the second surface 20b to the first surface 20a. In this case, since the first end portion 261a of the first portion 261 coincides with the first connection portion 20e, when the vapor deposition mask 20 is observed from the first surface 20a side, the first end portion 261 cannot be visually recognized. Section 261. Therefore, when the vapor deposition mask 20 is observed along the normal direction of the first surface 20a, the position of the contour of the vapor deposition mask 20 in the longitudinal direction D1 can be ea...

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Abstract

A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, anda second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.

Description

[0001] This application is a divisional application of the Chinese invention patent application with the application date of January 15, 2018, the title of the invention is "Evaporation Mask and Manufacturing Method of Evaporation Mask", and the application number is 201810034119.9. technical field [0002] Embodiments of the present disclosure relate to an evaporation mask and a method of manufacturing the evaporation mask. Background technique [0003] In recent years, high-definition display devices used in mobile devices such as smartphones and tablet PCs are required, for example, a pixel density of 400 ppi or more is required. In addition, even for mobile devices, there is an increasing need to respond to ultra-full high-definition, and in this case, the pixel density of the display device is required to be, for example, 800 ppi or higher. [0004] Among display devices, organic EL display devices are attracting attention because of good responsiveness, low power consu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/24
CPCC23C14/042C23C14/24C23F1/02H05B33/10H05B33/14H10K71/166C23F1/04H10K71/00B05C21/005
Inventor 内田泰弘松浦幸代池永知加雄
Owner DAI NIPPON PRINTING CO LTD