Whole-board packaging mold of flexible board and packaging method of whole-board packaging mold

Abstract

The invention discloses a whole-board packaging mold for a flexible board. The mold comprises a packaging lower mold and a packaging upper mold, and a material sheet groove for placing the flexible board is formed in the central position of the packaging lower mold; a polishing boss is arranged on the side face, facing the packaging lower mold, of the packaging upper mold in a protruding mode. Thepackaging upper mold covers the packaging lower mold, and the polishing boss is embedded into the material sheet groove. The polishing boss and the material sheet groove are combined to form a wholeplate packaging chamber; an exhaust component and a glue inlet component are arranged on the two sides, located in the material piece groove, of the lower packaging mold respectively, and the exhaustcomponent and the glue inlet component are arranged on the different sides. A glue injection sleeve used for injecting glue into the whole plate packaging cavity is arranged on the side, correspondingto the glue inlet component arranged on the lower packaging mold, of the upper packaging mold. The technical problem of flexible board LED packaging in the industry can be effectively solved, the purpose of whole board packaging is achieved, the technological process is effectively simplified, the manufacturing period is shortened, and the effects of reducing cost and reducing supply chains are achieved.

Description

technical field [0001] The invention relates to the technical field of FPC flexible board whole board die packaging, in particular to a flexible board whole board packaging mold and a whole board packaging method. Background technique [0002] As LED technology continues to mature, LED applications are becoming more and more extensive. In addition to replacing traditional lighting, they are also being used in indoor large-screen displays, smartphones / tablets, VR display devices, and other fields. The application of curved surfaces in these fields is gradually increasing. It has become a trend, so the development and production of curved LED screens made of flexible boards must also become a trend. However, flexible board packaging technology is another big problem, and there is no full-board compression molding packaging technology yet. The key point is that the flexible board is very easy to deform, and the whole board compression molding can easily cause uneven distributi...

AI Technical Summary

Problems solved by technology

The key point is that the flexible board is easy to deform, and the whole board compression molding can easily cause uneven distribution of colloid on the surface of the board. If it is a formal material, it will easily cause collapse, swing, etc.

[0003] At present, most of the existing mass production solutions for flexible board LEDs in the industry are to design and produce LED particles and flexible substrates separately, and finally assemble and assemble them. This kind of production and manufacturing has virtually increased costs, and has disadvantages such as complicated procedures and long production cycles. then the resulting

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