Solder container automatic supply device and method
A technology of automatic supply and soldering, which is applied in the assembly of printed circuits with electrical components, conductive pattern formation, printing, etc., can solve the problems of reducing the overall process efficiency, poor solder paste coating, etc. Efficiency, effect of preventing coating defects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0046]The advantages and characteristics of the present invention, and a method for achieving them will become apparent with reference to the accompanying drawings and the embodiments described in detail later. However, the present invention can be presented in a variety of forms that are different from each other, and is not limited to the embodiments disclosed below. The embodiments are only used to fully disclose the present invention and provide complete information to those with ordinary knowledge in the technical field to which the present invention pertains. It is provided to inform the scope of the invention, and the present invention is defined only by the scope described in the claims. Throughout the specification, the same reference signs refer to the same constituent elements.
[0047] In addition, the embodiments described in this specification will be described with reference to cross-sectional views and / or schematic views which are ideal illustrations of the pre...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


