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Solder container automatic supply device and method

A technology of automatic supply and soldering, which is applied in the assembly of printed circuits with electrical components, conductive pattern formation, printing, etc., can solve the problems of reducing the overall process efficiency, poor solder paste coating, etc. Efficiency, effect of preventing coating defects

Active Publication Date: 2022-07-05
HANWHA AEROSPACE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Such a conventional screen printing machine applies solder paste on the printed circuit board (especially the upper surface of the mask marked with a specific pattern of openings) after installing the solder container filled with solder. Here, if the solder Insufficient solder paste in the container may result in poor coating of the solder paste on the printed circuit board
[0005] And, if the solder paste in the solder container is completely exhausted, after the work of the screen printing machine needs to be interrupted, the operator personally performs the operation of replacing the solder container, so it is necessary to invest extra work time and manpower, thereby reducing the overall The problem of process efficiency

Method used

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  • Solder container automatic supply device and method
  • Solder container automatic supply device and method
  • Solder container automatic supply device and method

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Embodiment Construction

[0046]The advantages and characteristics of the present invention, and a method for achieving them will become apparent with reference to the accompanying drawings and the embodiments described in detail later. However, the present invention can be presented in a variety of forms that are different from each other, and is not limited to the embodiments disclosed below. The embodiments are only used to fully disclose the present invention and provide complete information to those with ordinary knowledge in the technical field to which the present invention pertains. It is provided to inform the scope of the invention, and the present invention is defined only by the scope described in the claims. Throughout the specification, the same reference signs refer to the same constituent elements.

[0047] In addition, the embodiments described in this specification will be described with reference to cross-sectional views and / or schematic views which are ideal illustrations of the pre...

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Abstract

The present invention relates to an automatic solder container supply device and method, comprising: a supply part for supplying the solder container by its own weight; a mounting part for mounting the solder container supplied from the supply part; a state of the solder container supplied and received by the unit, and apply solder paste on a printed circuit board; and a transfer unit that transfers the mounting unit back and forth between the supply unit and the operation unit, the operation unit including : a standby area where the solder container is located in a standby state before being mounted; a mounting area where a solder container moved from the standby area is mounted; The measurement value of the sensor for measuring the remaining amount of solder paste in the container is moved out of the mounted solder container.

Description

technical field [0001] The present invention relates to an automatic solder container supply device and method, and more particularly, to an automatic solder container supply device that can automatically discharge a solder-depleted container without interrupting the process and at the same time automatically supply a new container filled with solder and methods. Background technique [0002] Generally, a printed circuit board (PCB: Printed Circuit Board) built in as a main component of an electronic device such as a computer or a home appliance is coated with solder paste in a molten state in a predetermined pattern, so that many semiconductor chips or resistance chips are formed. Various forms of small electronic components can be mounted. [0003] This solder paste application process is performed by a solder paste application apparatus called a screen printer, which applies the solder paste supplied to the metal mask in which the openings of the specific pattern are for...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K3/12
CPCH05K3/34H05K3/1216H05K3/12B41F15/14H05K3/1233
Inventor 金贵韩崔智郁沈恩爀
Owner HANWHA AEROSPACE CO LTD