Mechanism for tightening thin film disc surface

Abstract

The invention discloses a mechanism for tightening a thin film disc surface. A thin film for photoetching has certain internal stress after being tightened. The mechanism comprises a thin film, an upper sealing cover, a cake disc, a lower tray and a driving push column, wherein the cake disc is composed of six fan-shaped bodies which are completely the same in structure, each fan-shaped body comprises a fan-shaped tray body, a guide chute and a thin film bonding boss area, and the lower tray comprises a circular tray body, a guide sliding key and a reset elastic body. The lower tray and the upper sealing cover are used for restraining the axial freedom degree of the cake disc, the rotation freedom degree of the cake disc is restrained through the guide sliding block and chute structure, the cake disc is limited to only extend outwards in the radius direction, the axial advancing action of the driving conical column is used as power for extending the cake disc outwards, and therefore, the film bonded to the film bonding boss area is evenly tightened and has certain internal stress.

Description

technical field [0001] The invention relates to the field of certain thin-film mirror equipment, and specifically proposes a mechanism for tightening the surface of a thin-film disk, so that the thin-film can be kept flat and tight with a certain internal stress during a photolithography process. Background technique [0002] Before the photolithography process of a photolithography machine that uses a thin film, it is necessary to pre-tighten the film used to make the surface of the film smooth and improve the success rate of photolithography. The film is fixed on the stretching mechanism, and the stretching of the stretching mechanism drives the film to make it tense. After the film is stretched on the stretch film mechanism, there will be a film cutting mechanism to fix the stretched film, and only cut off the middle circular part, and transfer it to the photolithography machine for the next photolithography process. [0003] Before photolithography, the photoresist will...

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Problems solved by technology

[0003] Before photolithography, the photoresist will be evenly coated on the film. If the surface of the film as the basis is uneven, the surface of the photoresist will be uneven, and the pattern will be out of shape during the photolithography process, making the photolithography machine unable to perform normal photolithography.

[0004] Most of the currently used stretch film mechanisms are rectangular, usually there is a problem that the film is not stretched tightly, and the film cutting process cannot be completed smoothly. When cutting the film, the PI film is cut continuously or the film is cut unevenly, resulting in waste of the film, which greatly improves the production efficiency of the film. Production cost and production time, resulting in low production efficiency

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