A Mechanism for Tightening the Surface of a Film Disk

Abstract

A mechanism for tensioning the surface of a film disk, so that the film used in a certain lithography has a certain internal stress after tension; the invention includes a film, an upper cover, a cake tray, a lower tray, and a driving push column; wherein, the cake The disk is composed of six sectors with the same structure, each sector includes a sector disk body, a guide chute and a film bonding boss area, the lower tray includes a circular disk body, a guide slide key and a reset elastic body; The tray and the upper cover restrict the axial freedom of the cake tray, and use the guide slider chute structure to restrict the rotation freedom of the cake tray, restricting the cake tray to only extend outward along the radial direction, and using the axial advance of the drive cone to move It is the driving force for the cake plate to protrude, so that the film bonded on the area of ​​the film bonding boss is evenly stretched and has a certain internal stress.

Description

technical field [0001] The invention relates to the field of certain thin-film mirror equipment, and specifically proposes a mechanism for tightening the surface of a thin-film disk, so that the thin-film can be kept flat and tight with a certain internal stress during a photolithography process. Background technique [0002] Before the photolithography process of a photolithography machine that uses a thin film, it is necessary to pre-tighten the film used to make the surface of the film smooth and improve the success rate of photolithography. The film is fixed on the stretching mechanism, and through the expansion of the stretching mechanism, the film is driven to make it tight; after the film is stretched on the stretching mechanism, a film cutting mechanism will fix the stretched film, and only the middle The circular part is transferred to the photolithography machine for the next photolithography process. [0003] Before photolithography, the photoresist will be evenl...

AI Technical Summary

Problems solved by technology

[0003] Before photolithography, the photoresist will be evenly coated on the film. If the surface of the film as the basis is uneven, the surface of the photoresist will be uneven, and the pattern will be out of shape during the photolithography process, making the photolithography machine unable to perform normal photolithography.

[0004] Most of the currently used stretch film mechanisms are rectangular, usually there is a problem that the film is not stretched tightly, and the film cutting process cannot be completed smoothly. When cutting the film, the PI film is cut continuously or the film is cut unevenly, resulting in waste of the film, which greatly improves the production efficiency of the film. Production cost and production time, resulting in low production efficiency

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