A pcb board processing method that avoids lamination after lamination
A PCB board and processing method technology, applied in the field of PCB board processing to avoid layer deviation after lamination, can solve problems such as inability to rivet, different expansion and contraction coefficients, layer deviation, etc., to avoid layer deviation and board curvature, and prevent layer deviation. partial and curved effect
Active Publication Date: 2022-08-09
VICTORY GIANT TECH HUIZHOU CO LTD
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Problems solved by technology
[0005] In order to solve the problem that the substrates of different thicknesses and different types of materials have different expansion and contraction coefficients during lamination, resulting in the phenomenon of layer deviation, and the problem that they cannot be riveted after lamination, the present invention provides a PCB board that avoids lamination after lamination processing methods
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[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0022] A PCB board processing method for avoiding layer deviation after lamination, comprising the following steps:
[0023] S1: Set up rivet holes 2, layer deviation detection rings 3 and expansion and contraction detection pads 4 on each substrate without expansion and shrinkage pre-placement. The positions of the rivet holes 2 on each substrate correspond to the layer deviation detection rings 3 and expansion and contraction. The positions of the detection pads 4 on each layer of the substrate also correspond to each other, and the rivet hole 2, the layer deviation detection ring 3 and the expansion and contraction detection pad 4 are not pre-placed, that is, they are set according to the ratio of 1:1;
[0024] The target 5 is set on each substrate according to the preset expansion and contraction value, and the inner layer circuit pattern is also pre-...
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Abstract
A PCB board processing method for avoiding layer deviation after lamination, comprising the following steps: S1: arranging rivet holes, layer deviation detection rings and expansion and contraction detection pads on each substrate without performing expansion and shrinkage pre-placement; according to preset The expansion and shrinkage value sets the target on each substrate, as well as the inner layer circuit pattern; S2: After the multi-layer substrate is riveted, the layer deviation detection ring is used to detect whether there is a layer deviation phenomenon. The substrate is pressed together. S3: Use the X‑RAR equipment to detect the targets of each layer. If the targets of each layer are completely coincident or the deviation is within the preset value, then press the multilayer substrate. If it is outside the preset value, proceed to the next step; S4: Detect the expansion and contraction value of each substrate by measuring the expansion and contraction detection pad, compare the measured data of each layer, correct the wrong expansion and contraction preload value of the corresponding substrate, and make the board again. The PCB board processed by the invention can avoid the phenomenon of layer deviation and plate curvature, and is suitable for mass production.
Description
technical field [0001] The invention relates to the field of PCB boards, in particular to a PCB board processing method for avoiding layer deviation after lamination. Background technique [0002] The huge demand of human society for information and data transmission drives the continuous development of communication technology. Every upgrade of mobile communication corresponds to an increase of about 10 times the downlink rate. As one of the key technologies of 5G, large-scale antenna technology, tens or even hundreds of antenna-scale antenna arrays are arranged at the base station. Through beamforming technology, different beams directed towards multiple target customers are constructed, and the interference between each beam is effectively reduced. Interference can effectively utilize precious and scarce frequency band resources and increase network capacity dozens of times. [0003] 5G large-scale antenna system structure, including dense radiation array, power division...
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IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/166
Inventor 张亚锋何艳球蒋华钟招娣张永谋叶锦群张宏
Owner VICTORY GIANT TECH HUIZHOU CO LTD