A Method for Improving the Interlayer Alignment of Rigid-Flex Board

A technology of soft-rigid combination board and alignment, which is applied in the direction of multilayer circuit manufacturing, printed circuit, electrical components, etc., to achieve the effect of reducing layer deviation scrap rate, improving lamination quality, and improving interlayer alignment

Active Publication Date: 2021-05-28
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the existing technical defects and provide a method for improving the alignment between the layers of the soft-rigid bonded board. This method solves the problem of pressing alignment hole deviation caused by pressing the covering film, and improves It improves the pressing quality of the soft-rigid combination board and reduces the partial scrap rate of the soft-rigid combination board.

Method used

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Embodiment

[0026] This embodiment provides a method for manufacturing a rigid-flex board, including a method for improving the alignment between layers of a rigid-flex board. The specific process is as follows:

[0027] (1) Cutting: According to the panel size of 520mm×620mm, the soft board core board and the hard board core board are cut out. The thickness of the soft board core board is 0.1mm, and the thickness of the outer copper foil is 0.5OZ. The soft board core board includes The soft board area and the soft-hard combination area; the thickness of the hard board core board is 0.18mm, and the thickness of the outer copper foil is 0.5OZ.

[0028] (2), inner layer circuit production (negative film process): inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the soft board core board, the film thickness of the photosensitive film is controlled to 8 μm, and a fully automatic exposure machine is used to 5 - 6-grid exposure ruler (21-grid exposu...

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PUM

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Abstract

The invention discloses a method for improving the interlayer alignment of a soft-rigid combination board, which comprises the following steps: making an inner layer circuit on a soft board core board; in the finished soft-hard board, the soft board core board includes a soft board area and soft-hard combination area; align and press the covering film on the soft board area of ​​the soft board core board, and then measure the expansion and contraction coefficient of the soft board core board; make the inner layer circuit on the hard board core board, and make the inner layer Exposure compensation is performed according to the expansion and contraction coefficient of the soft board core board during wiring; the same OPE punching machine is used to drill rivet holes at the corresponding riveting positions on the soft board core board and the hard board core board; The core board is pre-laminated with non-flowing PP, then riveted by rivets, and then pressed into a production board. The method of the invention solves the problem of offset alignment holes caused by pressing the covering film, improves the pressing quality of the soft-hard combination board, and reduces the scrapping rate of the soft-hard combination board layer deviation.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving the alignment between layers of a rigid-flex board. Background technique [0002] In the production process of the flexible and rigid board, it is necessary to press the hard board and the soft board. The traditional production process of the soft board before lamination is: material cutting-inner layer graphics-OPE punching-inner layer AOI-browning- Covering film-fast pressing-browning-post-process; among them, the purpose of OPE punching is to punch out the rivet holes and slot holes on the edge of the board for the press-fit positioning of hard and soft boards in the post-process, so as to Control precise alignment between layers. [0003] According to the above-mentioned traditional process, the OPE punching is performed first, so that in the subsequent rapid pressing process of the cover film, the soft board will expand and sh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K3/4691
Inventor 李红娇苟成宋建远胡荫敏何为
Owner SHENZHEN SUNTAK MULTILAYER PCB
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