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A multi -layer line board production method with defense

A production method and circuit board technology, applied in the field of circuit board production, can solve the problems of scrapped PCB boards, a large number of board layers, poor pressing effect, etc., and achieve the effects of reducing electroplating current, prolonging electroplating time, and reducing holes.

Active Publication Date: 2016-05-11
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among these three lamination methods, fusion is usually used for low-layer circuit boards with less than 4 layers, and the lamination effect is poor for high-layer circuit boards with more than 4 layers.
Riveting and PIN-LAM pressing are used for high-level circuit boards with more than 4 layers. However, during the pressing process of high-level PCB boards, due to the large number of board layers and the large thickness-to-diameter ratio, the boards shrink and expand abnormally during the pressing process. Whether it is riveting or PIN-LAM pressing, quality problems such as pressing deviation are prone to occur, resulting in the scrapping of the PCB board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The present embodiment provides a kind of production method of 32-layer circuit board, comprises following operation:

[0030] Conference Board;

[0031] Inner dry film;

[0032] AOI inspection;

[0033] Lamination;

[0034] drilling;

[0035] Copper plating once;

[0036] outer dry film;

[0037] Secondary copper plating;

[0038] etched copper;

[0039] Solderproof.

[0040] The above pressing process includes

[0041] a. Pre-laminated board and laminated board;

[0042] b. Use a PE punching machine to punch PE holes on the edge of the 32-layer circuit board;

[0043] c. Position the 32-layer circuit board through the above-mentioned PE punching, and use a fusion machine to perform contact point fusion on the edge of the 32-layer circuit board. The fusion temperature is 260°C and the fusion time is 99s;

[0044] d. Riveting, positioning and riveting the 32-layer circuit board on the riveting machine using the above-mentioned PE punching holes;

[0045] e. ...

Embodiment 2

[0052] This embodiment provides a production method of a 28-layer circuit board, the process of which is consistent with that of Embodiment 1.

[0053] Its pressing process includes

[0054] a. Pre-laminated board and laminated board;

[0055] b. Use a PE punching machine to punch PE holes on the edge of the 28-layer circuit board;

[0056] c. Position the 28-layer circuit board through the above-mentioned PE punching holes, and use a fusion machine to perform contact point fusion on the edge of the 32-layer circuit board. The fusion temperature is 235°C and the fusion time is 89s;

[0057] d. Riveting, positioning and riveting the 28-layer circuit board on the riveting machine using the above-mentioned PE punching holes;

[0058] e. Align the fused, riveted and reinforced 28-layer circuit boards on the pressing machine for heating and pressing.

[0059] In this embodiment, the drilling process is carried out in the punching machine at a cutting speed of 45 IPM and a cuttin...

Embodiment 3

[0063] This embodiment provides a method for producing a 36-layer circuit board, the process of which is consistent with that of Embodiment 1.

[0064] Its pressing process includes

[0065] a. Pre-laminated board and laminated board;

[0066] b. Use a PE punching machine to punch PE holes on the edge of the 36-layer circuit board;

[0067] c. Position the 36-layer circuit board through the above-mentioned PE punching holes, and use a fusion machine to perform contact point fusion on the edge of the 32-layer circuit board. The fusion temperature is 290°C and the fusion time is 115s;

[0068]d. Riveting, positioning and riveting the 36-layer circuit board on the riveting machine using the above-mentioned PE punching holes;

[0069] e. Heat and press the fused and riveted 36-layer circuit board on the pressing machine.

[0070] In this embodiment, the drilling process is carried out in the punching machine at a cutting speed of 58 IPM and a cutting speed of 850 IPM, and the d...

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PUM

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Abstract

The invention provides a multilayer circuit board production method capable of preventing layer deviation. The method comprises a multilayer board pressing-in process, is characterized in that the multilayer board pressing-in process comprises the following steps: a, performing pre-stacking and stacking on boards; b, performing PE punching on the edge of a multilayer circuit board; c, fusing; d, riveting; and e, heating for pressing-in. According to the invention, in the pressing-in process, the fusing and riveting are used for gradually reinforcing the multilayer circuit board, and lastly, the heating for the pressing-in is carried out to form the multilayer circuit board, so that the problem that the multilayer circuit board has high probability of layer deviation during pressing-in is effectively solved; the method particularly suitable for the production of high-level multilayer circuit boards; and meanwhile, the abnormal shrinkage and expansion of inner-layer boards are compensated by the way that the PE punching is performed on the edge of the multilayer circuit board, so that layer deviation among the inner-layer boards in the pressing-in process is further prevented, the defective rate of products is reduced, and precision of the multilayer circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a multilayer circuit board production method for preventing layer deviation. Background technique [0002] Printed circuit boards generally include single-layer boards and multi-layer boards. The pressing process of pressing the inner layer circuit board with copper foil and film into a multilayer circuit board after pretreatment of inner layer dry film, copper etching, AOI inspection, etc. is an essential process in the production of multilayer circuit boards . Existing lamination methods for multilayer circuit boards mainly include fusion, riveting and PIN-LAM lamination. Among the three lamination methods, fusion is usually used for low-layer circuit boards with less than 4 layers, and the lamination effect is poor for high-layer circuit boards with more than 4 layers. Riveting and PIN-LAM pressing are used for high-level circuit boards with more than 4 lay...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 李爱华李飞宏曾祥福张晃初
Owner VICTORY GIANT TECH HUIZHOU CO LTD