A press-fit method for preventing layer deviation of false laminates

Abstract

The invention relates to the technical field of circuit board production, in particular to a pressing method for preventing layer deviation of false laminates. In the present invention, a layer of buffer cushion layer is respectively laid on the upper and lower sides of the superimposed structure to separate it from the steel plate, and the rivet caps or rivets protruding from the superimposed structure are accommodated in the corresponding accommodation holes on the cushion layer, so that the pressing During the process, the upper and lower positions of the rivets are elevated. No matter how much pressure is applied during pressing, the rivets will never be able to touch the steel plate and will not lift up the steel plate, thus ensuring that the superimposed structure is evenly pressed by the steel plate, and avoiding any damage caused during the pressing process. The superimposed structure is not uniformly stressed and the prepreg is heated and melted with fluidity, which leads to the problem of layer deviation. By pressing the superimposed structure to form a false laminate through the method of the invention, the problem of layer deviation caused by the pressing process can be completely avoided.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a pressing method for preventing layer deviation of false laminates. Background technique [0002] Printed circuit board is also called circuit board (PCB, Printed Circuit Board). The production of circuit boards includes two links of circuit design and manufacturing. The manufacture of circuit boards is based on the previous circuit design. The manufacturing process is generally as follows: according to the design requirements, the inner core board is cut into the required size in the cutting process→ Lay film on the inner core board → use the inner layer film to expose in position → develop and remove the uncured film to form an inner layer pattern → etch the copper layer not covered by the film on the inner core board to form the inner layer circuit → fade the film → Stack the inner core boards in a certain order and press them together at high temperature to...

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem that the lamination method of the existing false laminates easily leads to layer deviation, and provides a lamination method for preventing the lamination deviation of the false laminates, which can completely avoid the problem of layer deviation caused by the lamination process

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