A method for quickly judging the burn-through depth of metal paste without damage
A metal paste, non-destructive technology, used in material excitation analysis, semiconductor/solid-state device testing/measurement, electrical components, etc. problem, to achieve the effect of simple and convenient detection method
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Embodiment 1
[0027] This embodiment provides a method for quickly judging the burn-through depth of metal slurry without damage, such as figure 1 shown, including the following steps:
[0028] Step 1: take the cleaned P-type silicon wafer as the substrate;
[0029] Step 2: Grow a passivation film on the surface of the substrate, the passivation film is AlO x / SiN x Double-layer passivation film, the total thickness of the passivation film is 200nm, and the sample to be treated is obtained;
[0030] Step 3: Coating the metal slurry on one side of the sample to be processed obtained in Step 2, and then sintering at a sintering temperature of 800° C. to obtain an experimental sample;
[0031] Step 4: Use the PL tester to collect the PL intensity values of the metal paste area 1 and the non-metal paste area 2 of the experimental sample obtained in step 3 respectively, and obtain the average PL intensity value PL of the metal paste area 1 of the experimental sample 金属 and the average PL i...
Embodiment 2
[0037] This embodiment provides a method for quickly judging the burn-through depth of metal slurry without damage, such as figure 1 shown, including the following steps:
[0038] Step 1: take the cleaned N-type silicon wafer as the substrate;
[0039] Step 2: growing a passivation film on the surface of the substrate, the passivation film is a SiN passivation film, and the total thickness of the passivation film is 200 nm to obtain a sample to be processed;
[0040] Step 3: Coating the metal slurry on one side of the sample to be processed obtained in Step 2, and then sintering at a sintering temperature of 800° C. to obtain an experimental sample;
[0041] Step 4: Use the PL tester to collect the PL intensity values of the metal paste area 1 and the non-metal paste area 2 of the experimental sample obtained in step 3 respectively, and obtain the average PL intensity value PL of the metal paste area 1 of the experimental sample 金属 and the average PL intensity value PL of ...
Embodiment 3
[0044] This embodiment provides a method for quickly judging the burn-through depth of metal slurry without damage, such as figure 1 shown, including the following steps:
[0045] Step 1: take the cleaned N-type silicon wafer as the substrate;
[0046] Step 2: Grow a passivation film on the surface of the substrate, the passivation film is SiO 2 / SiN double-layer passivation film, the total thickness of the passivation film is 200nm, and the sample to be treated is obtained;
[0047] Step 3: Coating the metal slurry on one side of the sample to be processed obtained in Step 2, and then sintering at a sintering temperature of 800° C. to obtain an experimental sample;
[0048] Step 4: Use the PL tester to collect the PL intensity values of the metal paste area 1 and the non-metal paste area 2 of the experimental sample obtained in step 3 respectively, and obtain the average PL intensity value PL of the metal paste area 1 of the experimental sample 金属 and the average PL inte...
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Abstract
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