Method for quickly determining burn-through depth of metal slurry without damage
A metal paste, non-damaging technology, applied in the direction of material excitation analysis, electrical components, circuits, etc., can solve the problems of reduced burn-through depth of metal paste, no detection of burn-through depth of metal paste, etc., and achieves a simple detection method convenient effect
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Embodiment 1
[0027] This embodiment provides a method for quickly judging the burn-through depth of metal paste without damage, such as figure 1 shown, including the following steps:
[0028] Step 1: Take the cleaned P-type silicon wafer as the substrate;
[0029] Step 2: grow a passivation film on the surface of the substrate, the passivation film is AlO x / SiN x Double-layer passivation film, the total thickness of the passivation film is 200nm, and the sample to be processed is obtained;
[0030] Step 3: Coating the metal paste on one side of the sample to be treated obtained in Step 2, and then sintering, the sintering temperature is 800°C, to obtain the experimental sample;
[0031] Step 4: Use the PL tester to collect the PL intensity values of the metal paste area 1 and non-metal paste area 2 of the experimental sample obtained in step 3 respectively, and obtain the average PL intensity value PL of the metal paste area 1 of the experimental sample 金属 and the average PL intensi...
Embodiment 2
[0037] This embodiment provides a method for quickly judging the burn-through depth of metal paste without damage, such as figure 1 shown, including the following steps:
[0038] Step 1: Take the cleaned N-type silicon wafer as the substrate;
[0039] Step 2: growing a passivation film on the surface of the substrate, the passivation film is a SiN passivation film, the total thickness of the passivation film is 200nm, and the sample to be processed is obtained;
[0040] Step 3: Coating the metal paste on one side of the sample to be treated obtained in Step 2, and then sintering, the sintering temperature is 800°C, to obtain the experimental sample;
[0041] Step 4: Use the PL tester to collect the PL intensity values of the metal paste area 1 and non-metal paste area 2 of the experimental sample obtained in step 3 respectively, and obtain the average PL intensity value PL of the metal paste area 1 of the experimental sample 金属 and the average PL intensity value PL of the ...
Embodiment 3
[0044] This embodiment provides a method for quickly judging the burn-through depth of metal paste without damage, such as figure 1 shown, including the following steps:
[0045] Step 1: Take the cleaned N-type silicon wafer as the substrate;
[0046] Step 2: grow a passivation film on the surface of the substrate, the passivation film is SiO 2 / SiN double-layer passivation film, the total thickness of the passivation film is 200nm, and the sample to be processed is obtained;
[0047] Step 3: Coating the metal paste on one side of the sample to be treated obtained in Step 2, and then sintering, the sintering temperature is 800°C, to obtain the experimental sample;
[0048] Step 4: Use the PL tester to collect the PL intensity values of the metal paste area 1 and non-metal paste area 2 of the experimental sample obtained in step 3 respectively, and obtain the average PL intensity value PL of the metal paste area 1 of the experimental sample 金属 and the average PL intensity ...
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Abstract
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