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Chip-integrated dielectric resonator and antenna

A technology for integrating dielectric resonators and substrates, applied in resonators, antennas, antenna arrays, etc., can solve the problems of low processing and assembly efficiency, large errors, etc., and achieve the effects of improving yield, ensuring performance, and reducing complexity

Active Publication Date: 2021-03-23
浙江蓝箭防务科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a substrate-integrated dielectric resonator and antenna for the defects of low processing and assembly efficiency and large errors in the prior art.

Method used

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  • Chip-integrated dielectric resonator and antenna
  • Chip-integrated dielectric resonator and antenna
  • Chip-integrated dielectric resonator and antenna

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Embodiment 1

[0046] Figure 6 Schematically shows the exploded view of Embodiment 1 of the substrate-integrated dielectric resonator antenna of the present invention, for comparison figure 1 , it can be seen that the resonator unit in this embodiment is not isolated, and this embodiment is the case of M=1, N=1.

[0047] Specifically, the substrate-integrated dielectric resonator antenna in this embodiment is formed by laminating multilayer dielectric substrates 1, 2, and 3. The plane dimensions of the multilayer dielectric substrates 1, 2, and 3 are the same, and the topmost one The dielectric substrate 1 is hollowed out to form the substrate-integrated dielectric resonator of the present invention, as shown by 100 in the figure, which is the hollowed out area.

[0048] Here, the so-called same plane size means that the edge contours of the plane projections of the dielectric substrates 1 , 2 , and 3 are completely the same. For example, in this embodiment, the edge contours of the plana...

Embodiment 2

[0057] On the basis of the first embodiment, considering that multiple dielectric resonators need to be in the same plane in the antenna array, the connection between them is particularly important. To this end, this embodiment provides a substrate-integrated dielectric resonator antenna, and this embodiment is the case where M=4 and N=1. refer to Figure 9 , 10 , which is specifically a 4×1 series-parallel TE 20 Modular SIW fed differential substrate integrated dielectric resonator antenna.

[0058] Similarly, this embodiment is also formed by lamination of a multi-layer structure. The metal ground 5 is provided with a coupling slot 501 parallel to the rectangular portion 12, and the metal ground 4 is provided with four sets of coupling slots 401. Each set of coupling slots 401 is connected to a resonant Corresponding to the device unit, the coupling slit 401 is also parallel to the rectangular part 12, and the metal through hole 201 is opened on the substrate 2 to form a ...

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Abstract

The invention discloses a substrate-integrated dielectric resonator and an antenna. The substrate-integrated dielectric resonator includes a plurality of portions formed by hollowing out a dielectricsubstrate. The plurality of portions include N rectangular portions. Hollowed-out areas are arranged between the two long sides of each rectangular portion and other portions. The two short sides of each rectangular portion are connected with other portions. Each rectangular portion is provided with a plurality of rows of metalized via holes to divide the entire rectangular portion into M rectangular resonator units arranged along the rectangular portion. The length of the long side of each resonator unit is greater than 1.5 times the length of the short side of the resonator unit. The workingmode electric field of the resonator unit is perpendicular to the long side of the resonator unit. The M, N are both positive integers greater than or equal to 1. The substrate-integrated dielectricresonator is beneficial to reducing the complexity of processing and assembly, improves the yield, and has a self-encapsulation characteristic.

Description

technical field [0001] The invention relates to the communication field, in particular to a substrate-integrated dielectric resonator and an antenna. Background technique [0002] refer to figure 1 , The traditional dielectric resonator is processed separately by using high dielectric constant and low loss ceramic materials, and its feed circuit is processed separately. When assembling, the two are bonded with dielectric glue. This assembly method has low efficiency and relatively large errors, especially for dielectric resonator antennas with relatively high frequencies. Due to their small size, assembly errors are large and the yield is relatively low. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a substrate-integrated dielectric resonator and an antenna for the above-mentioned defects of low processing and assembly efficiency and large errors in the prior art. [0004] The technical solution adopted by th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P7/10H01Q21/00H01Q21/08H01Q1/50
CPCH01P7/10H01Q1/50H01Q21/0006H01Q21/08
Inventor 葛杰唐慧
Owner 浙江蓝箭防务科技有限公司
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