Reagent for detecting content of polyethylene glycol in electroplating acidic copper solution and detection method

A polyethylene glycol and detection method technology, which is applied in color/spectral characteristic measurement, material analysis by observing the influence of chemical indicators, and analysis by making materials undergo chemical reactions, can solve the problem of difficult to meet the rapid regulation of components. Requirements, low precision and accuracy, poor operability, etc., to achieve the effect of low cost, high precision and accuracy, and wide application range

Inactive Publication Date: 2019-12-10
JIANGXI UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the traditional analysis and detection method has many interference factors, poor operability, low precision and accuracy, and it is difficult to meet the requirements of the enterprise's actual production process for rapid control of components.

Method used

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  • Reagent for detecting content of polyethylene glycol in electroplating acidic copper solution and detection method
  • Reagent for detecting content of polyethylene glycol in electroplating acidic copper solution and detection method
  • Reagent for detecting content of polyethylene glycol in electroplating acidic copper solution and detection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039]A reagent for detecting the content of polyethylene glycol in an acid copper plating solution, the components of which include bismuth subcarbonate, an acidic agent and 0.1-1.0 mol / L potassium iodide, wherein the added amount of the bismuth subcarbonate is 0.1-2.0 g; the acidic agent is any one of glacial acetic acid, 5-20% hydrochloric acid, and 0.2-2mol / L nitric acid, and the addition amount of the acidic agent is 5-30mL; the addition amount of the potassium iodide is 2-30mL ;

[0040] The preparation method of the reagent of polyethylene glycol content in the above-mentioned detection electroplating acid copper solution is:

[0041] Weigh bismuth subcarbonate into a brown Erlenmeyer flask, add an acidic agent, and ultrasonically treat for 5-20 minutes to disperse the powder evenly, then slowly add potassium iodide while stirring, seal the bottle with a cork, and continue the ultrasonic treatment for 5-20 minutes in the dark. After 60 minutes, the detection reagent wa...

Embodiment 2

[0052] Taking 30mg / L polyethylene glycol (M=6000) as an example, explore the influence of centrifugation speed on absorbance during centrifugation during sample preparation:

[0053] Step 1. Configuration of standard electroplating solution

[0054] S1: Take polyethylene glycol with a molecular weight of M=6000 and put it in a vacuum drying oven, and dry it at 40°C for 4 hours to remove moisture; accurately weigh 1.0g of polyethylene glycol and dissolve it in a 1000mL volumetric flask, and use Dilute to the mark with deionized water, and make 1.0g / L polyethylene glycol stock solution;

[0055] S2: Measure 0-10mL of concentrated sulfuric acid in a 50mL beaker, add an appropriate amount of deionized water to dilute, then weigh 0-80g of copper sulfate pentahydrate into the aforementioned beaker, and heat it at 80°C to dissolve it. Then add 3.0 mL of the polyethylene glycol stock solution prepared in step S1 to the aforementioned beaker, and after the temperature drops to room te...

Embodiment 3

[0066] Taking 30mg / L polyethylene glycol (M=6000) as an example, explore the influence of the addition amount of the reagent used as the chromogen during the chromogenic operation on the absorbance:

[0067] Step 1. Configuration of standard electroplating solution

[0068] Its step is with embodiment 2.

[0069] Step 2. Sample configuration

[0070] S1: Use a pipette to pipette 15 mL of a prepared standard plating solution with a concentration of 30 mg / L into six 50 mL centrifuge tubes, and then adjust the pH value to 7 with sodium hydroxide solution to obtain 6 copies of the same pretreatment solution.

[0071] S2: Shake the pretreatment solution prepared in step S1, and then perform centrifugation at a speed of 5000 r / min for 8 minutes, and then take the supernatant to obtain 6 copies of the same solution to be tested.

[0072] Step 3, color development operation

[0073] Pipette 5mL of the solution to be tested prepared in step 2 into six 10mL stoppered test tubes, the...

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Abstract

The invention discloses a reagent for detecting the content of polyethylene glycol in an electroplating acidic copper solution and a detection method, and belongs to the technical field of organic matter detection. The reagent comprises the following components: 0.1-2.0 g of bismuth subcarbonate, 5-30 mL of glacial acetic acid (hydrochloric acid having a concentration of 5-20% or nitric acid having a concentration of 0.2-2 mol/L), and 2-30 mL of potassium iodide having a concentration of 0.1-1.0 mol/L. The detection method comprises the following steps: preparation of the reagent, preparationof a standard electroplating solution, preparation of a sample, color development operation, absorbance determination and linear analysis, and detection application. According to the method, the conditions for inhibiting hydrolysis of the bismuth subcarbonate and reaction products of the bismuth subcarbonate are determined, interference of other factors is eliminated, the content of the polyethylene glycol in the acidic sulfate copper electroplating solution can be accurately determined, and the method is easy, convenient and rapid to operate, good in repeatability and high in accuracy. The relative standard deviation is less than 5%, the lowest detection line is 1 ppm, and the linear correlation is 0.9965.

Description

technical field [0001] The invention relates to the technical field of organic matter detection, in particular to a reagent and a detection method for detecting polyethylene glycol content in an acid copper electroplating solution. Background technique [0002] Copper plating on metal and non-metal surfaces is the most commonly used process for decorative surface plating and functional parts electroplating. Sulfate copper plating is characterized by bright, dense, and good leveling ability, simple, stable, strong dispersion ability and high current efficiency of the plating solution. Advantages, widely used in chemical plating of plastics, electroplating of metal parts, connection of printed board holes, etc. In its process, additives are the key factors for the excellent performance of acid sulfate copper plating. Appropriate additives can stabilize the composition of the plating solution and significantly improve the crystal structure of the coating. In order to meet the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/78G01N21/31
CPCG01N21/78G01N21/31
Inventor 唐云志陆冰沪师慧娟李大双樊小伟谭育慧刘耀
Owner JIANGXI UNIV OF SCI & TECH
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