Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic device and preparation method thereof

A technology for electronic devices and encapsulation layers, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as large space and unfavorable carrying, and achieve the effect of reducing tensile stress

Active Publication Date: 2019-12-10
BOE TECH GRP CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, display devices are developing towards larger screens. For portable electronic devices, large-screen display devices occupy a large space, which is not conducive to portability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device and preparation method thereof
  • Electronic device and preparation method thereof
  • Electronic device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] This embodiment provides an electronic device, such as Figure 1 to Figure 3 As shown, the electronic device includes a flexible substrate 1011 and a plurality of functional layers (such as 1012, 1013 shown in the figure) disposed on the flexible substrate 1011; wherein, the plurality of functional layers include a light emitting layer 1013, at least one layer of weak layer 1014 and at least one bonding layer 1015; the bonding layer 1015 includes at least one bendable region 1015A, and the Young's modulus of the bonding layer 1015 in the bendable region 1015A is higher than the Young's modulus of the bonding layer 1015 in other regions 1015B quantity. In this embodiment, the other region 1015B is the region of the bonding layer 1015 except the bendable region 1015A.

[0036]For example, in this embodiment, the electronic device can be bent at a position corresponding to the bendable region 1015A. For example, when the electronic device is bent, the at least one weak l...

Embodiment 2

[0051] This embodiment provides an electronic device, such as Figure 6 to Figure 8 As shown, the electronic device includes a flexible substrate 1011 and multiple functional layers (such as 1012 and 1013 shown in the figure) disposed on the flexible substrate 1011 . In this embodiment, the multiple functional layers include a first weak layer 1014 and a second weak layer 1012; the multiple functional layers also include a first bonding layer 1015 and a second bonding layer 1018, and the first bonding layer 1015 is located in the first weak layer 1014 on the side away from the flexible substrate 1011 , the second bonding layer 1018 is located on the side of the flexible substrate 1011 away from the second weak layer 1018 . The first bonding layer 1015 includes a first bendable region 1015A, the second bonding layer 1018 includes a second bendable region 1018A, and the first bendable region 1015A and the second bendable region 1018A are formed on the flexible substrate 1011. T...

Embodiment 3

[0061] This embodiment provides a method for preparing an electronic device, such as Figure 9 As shown, the preparation method includes step S101 and step S102.

[0062] Step S101: providing a flexible substrate.

[0063] In this embodiment, the material of the flexible substrate may include flexible materials such as polyimide (PI), polydimethylsiloxane (PMDS) or polyurethane (PU), which is not specifically limited in this embodiment.

[0064] Step S102: forming multiple functional layers on the flexible substrate.

[0065] In this embodiment, the multiple functional layers include a light emitting layer, at least one weak layer and at least one bonding layer. The bonding layer includes at least one bendable region, and the Young's modulus of the bonding layer in the bendable region is formed to be higher than that of the bonding layer in other regions.

[0066] In this embodiment, the at least one weak layer is easily broken when the electronic device is bent. At this ti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an electronic device and a preparation method thereof. The electronic device comprises a flexible substrate and a plurality of functional layers arranged on the flexible substrate. A plurality of functional layers include a light emitting layer, at least one weak layer and at least one bonding layer. The bonding layer comprises at least one bendable region, and the Young'smodulus of the bonding layer in the bendable region is higher than the Young's modulus of the bonding layer in other regions. The Young's modulus of the bonding layer in the bendable region in the electronic device is relatively high so that the neutral layer (i.e., the layer that does not generate strain during bending) generated during bending of the electronic device can move towards the direction of the weak layer, thus reducing the tensile stress received by the weak layer during bending.

Description

technical field [0001] Embodiments of the present disclosure relate to an electronic device and a manufacturing method thereof. Background technique [0002] At present, display devices are developing toward larger screens. For portable electronic devices, large-screen display devices occupy a large space, which is not conducive to portability. Therefore, portable electronic devices are facilitated using bendable or foldable display devices. Folding display devices have attracted more and more attention due to their advantages of large screen size and portability. Folding display devices can be used, for example, in many electronic devices such as mobile communication terminals, tablet computers, e-books, and navigation devices. Contents of the invention [0003] At least one embodiment of the present disclosure provides an electronic device, which includes: a flexible substrate and a plurality of functional layers disposed on the flexible substrate; wherein the pluralit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/00H01L51/52H01L21/77H10K99/00
CPCH10K59/35H10K59/12H10K77/111H10K50/844H10K59/1201Y02E10/549
Inventor 黄华王威谢昌翰
Owner BOE TECH GRP CO LTD