Optical projection device
A projection device and optical technology, which is applied to optics, projection devices, optical components, etc., can solve the problems of difficulty in quickly dissipating heat, deformation of optical devices, and structural light deformation failure of optical projection devices, and achieves simple structure, improved quality, The effect of avoiding distortion of the optics
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no. 1 example
[0059] see Figures 1 to 4 , is an optical projection device 100 provided by the present invention. The optical projection device 100 includes a circuit board 10 , a light source 20 electrically connected to the circuit board 10 , and an optical device 30 provided on the circuit board 10 .
[0060]The circuit board 10 is a rigid board, a flexible board or a rigid-flex board. In this embodiment, the circuit board 10 is a ceramic board. The bottom of the circuit board 10 is also provided with a reinforcing plate 110 . The size of the circuit board 10 is smaller than that of the reinforcing board 110 , so that two longer side edges of the reinforcing board 110 are exposed outside the circuit board 10 . The reinforcing plate 110 is made of metal, which can strengthen the heat dissipation effect of the optical projection device 100 . A portion of the reinforcing board 110 exposed outside the edge of the circuit board 10 is provided with a thermally conductive silicone 112 .
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no. 2 example
[0083] see Figure 5 , the bearing seat 41 included in the optical projection device provided in the second embodiment. The structure of the bearing seat 41 provided in this embodiment is basically the same as that of the bearing seat 31 provided in the first embodiment, the difference lies in:
[0084] In this embodiment, the width of the metal heat dissipation layer 335 formed on one of the side surfaces 315 of the lower housing part 310 of the bearing seat 41 is narrowed to form a conductive circuit 345 extending to the top end 313 of the upper housing part. The metal heat dissipation layer 350 on the side surface is used for heat conduction. Since the metal heat dissipation layer 335 is made of metal conductive material, the conductive circuit 345 connected to the metal heat dissipation layer 350 can be used for conduction. Of course, it can be understood that according to actual needs, another conductive line 345 can be formed on the other side surface opposite to the si...
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