Encapsulation module, encapsulation method thereof, and electronic device
A technology for encapsulating modules and encapsulation methods, which is applied in the direction of electrical equipment structural parts, electrical components, cooling/ventilation/heating renovation, etc., and can solve problems such as affecting work efficiency and poor overall heat dissipation performance of modules.
Active Publication Date: 2021-01-01
HUAWEI TECH CO LTD
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Problems solved by technology
At present, each device of the equipment is developing towards the miniaturization direction of the module, and many electronic components such as power devices, control integrated circuits and passive devices have greatly improved the power density and power consumption of modules such as power supplies. The overall heat dissipation performance of the module is poor, which seriously affects the work efficiency
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Embodiment Construction
[0062] Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.
[0063] Embodiments of the present application provide a packaging module and its preparation and electronic equipment. A heat dissipation block is used to assemble the mounting surface of the substrate and at least partially cover the surface of the winding. The plastic packaging structure covering the mounting surface exposes at least part of the heat dissipation block. away from the surface of the substrate, so that the heat dissipation block provides a heat transfer path for the winding, acts as a heat transfer bridge, reduces the thermal resistance of the winding to the external environment, and can reduce the heat generated by the winding during operation. The heat is transmitted to the external environment through the plastic packaging structure, realizing rapid heat dissipation of the winding, improving the overall heat dissipa...
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The invention provide packaging modules, packaging methods thereof and electronic equipment. A packaging module comprises a base plate, magnetic cores, windings, heat dissipation blocks and a plasticpackaging structure. The magnetic cores comprise bodies and mounting feet connected with the bodies. The mounting feet are connected with the base plate. The windings are set in the base plate or on the surface of the base plate and are set around the mounting legs, thereby matching with the magnetic cores to carry out electromagnetic transformation. The heat dissipation blocks and the bodies areset at the same side of the base plate at intervals. In a direction vertical to the base plate, the heat dissipation blocks and the windings are at least partially overlapped. The magnetic cores and the heat dissipation blocks are packaged on the base plate by the plastic packaging structure. The plastic packaging structure comprises a top surface away from the base plate. the bodies and the heatdissipation blocks stretch to the top surface along the direction vertical to the base plate. The surfaces of the magnetic cores and the heat dissipation blocks away from the base plate, and the top surface are coplanar. The surfaces of the magnetic cores and the heat dissipation blocks away from the base plate protrude from the top surface, so heat of the magnetic cores and the windings is transferred to an external environment. Integrated heat dissipation performance of the packaging module is improved. Working efficiency of the packaging module is improved.
Description
technical field [0001] The present application relates to the technical field of packaging, in particular to a packaging module, a packaging method thereof, and electronic equipment. Background technique [0002] With the development of science and technology, more and more devices are developing in the direction of miniaturization and integration. At present, each device of the equipment is developing towards the miniaturization direction of the module, and the power supply and other modules include many electronic components such as power devices, control integrated circuits and passive devices, which greatly improve the power density and power consumption of the power supply and other modules. The overall heat dissipation performance of the module is poor, which seriously affects the working efficiency. Contents of the invention [0003] The present application provides a packaging module, a packaging method thereof, and an electronic device, which are used to improve ...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/209
Inventor 潘伟健胡志祥叶刚
Owner HUAWEI TECH CO LTD