PCB golden finger tape attaching equipment and tape attaching method

A PCB board, gold finger technology, applied in the PCB board gold finger sticking equipment and the field of sticking, can solve the problems of low sticking efficiency, high sticking cost, wrinkles, etc., and achieve high sticking accuracy and high sticking efficiency. Effect

Pending Publication Date: 2020-01-10
湖北兆元科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pure manual gluing is slow, easy to stick and wrinkle, low gluing efficiency, and low sticking accuracy. At the same time, manual sticking will easily leave fingerprints and sweat stains on the board surface, causing the PCB to be oxidized, thus affecting the finished product of the PCB. rate, and it is also very prone to consequences such as scratching the surface of the board
Although the adhesive tape of the glue machine can avoid the problem of manual glue application, different PCB board models require different glue machines for glue application. The cost of glue application is high, and it is not suitable for batch glue application.

Method used

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  • PCB golden finger tape attaching equipment and tape attaching method
  • PCB golden finger tape attaching equipment and tape attaching method
  • PCB golden finger tape attaching equipment and tape attaching method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] see figure 1 As shown, Embodiment 1 of the present invention provides a PCB gold finger glue sticking equipment, which includes a workbench 1, a clamping device 2, a glue feeding device 3, a negative pressure structure 4 and a glue cutting device 5, and on the workbench 1 There is a slot 10 extending straight, and the clamping device 2 is located at the slot 10. The height of the clamping device 2 is not higher than the height of the workbench 1. The clamping device 2 has two relatively movable clamping surfaces 20, The two clamping surfaces 20 are far away from each other to form a clamping space for clamping PCB boards, and the distance between the two clamping surfaces 20 can be adjusted according to PCB boards of different thicknesses to clamp PCB boards of different thicknesses The glue feeding device 3 includes a material roll 30 for winding the adhesive tape 6, a clamping assembly 31 and a first driving device 32, and the clamping assembly 31 is used to clamp the...

Embodiment 2

[0048] see Image 6 As shown, the basic content of embodiment 2 of the present invention is the same as that of embodiment 1, except that the glue assembly 31, the glue assembly 31 of embodiment 2 of the present invention includes two glue heads 310 arranged up and down, the glue head 310 is arranged along the length direction of the clamping plate 21, and the clamping head 310 is provided with a U-shaped card slot 311 for clamping the PCB board, and the length of the adhesive tape 6 clamped by the clamping head 310 is just in line with the The depths of the notches are equal, and the clamping space formed between the U-shaped card slot 311 and the two clamping plates 21 is connected. When applying glue, insert the PCB board from the U-shaped card slot 311 into the clamping space. In this way, the adhesive tape 6 clamped by the clamping head 310 is just attached to the edge of the PCB board, so that the waste of the adhesive tape 6 will not be caused, and the length of the adh...

Embodiment 3

[0050] Embodiment 3 of the present invention provides a method for applying glue to a PCB gold finger, which uses the above-mentioned equipment for applying glue to a PCB gold finger to apply glue to a PCB gold finger. The specific steps are as follows:

[0051] At first the first driving device 32 drives the clamp assembly 31 to move towards the direction close to the material roll 30, so that the clamp assembly 31 is pulled out through the glue cutting device 5 and clamps the adhesive tape 6 sent by the material roll 30; then the first drive The device 32 drives the clamping assembly 31 to move away from the material roll 30, and the adhesive tape 6 is adsorbed on the clamping device 2 under the action of the negative pressure generated by the negative pressure structure 4, and is determined according to the length of the PCB board to be pasted. The length of the tape 6 is to control the movement distance of the material roll 30, so as to meet the glue length of PCB boards o...

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PUM

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Abstract

The invention discloses PCB golden finger tape attaching equipment and a tape attaching method. The tape attaching equipment comprises a workbench, a clamping device, a tape feeding device, a negativepressure structure and a tape cutting device. The workbench is provided with a linearly extending slot. The clamping device is arranged at the slot, is used for clamping a PCB, and has two clamping surfaces capable of moving relatively. The tape feeding device comprises a material roll, a tape clamping assembly and a first driving device. The tape clamping assembly is used for clamping a tape onthe material roll; the first driving device is used for driving the tape clamping assembly to move along the slot; the negative pressure structure is arranged under the workbench and is used for forming negative pressure towards the position below the workbench in the area where the clamping device is located; and the tape cutting device is arranged beside the material roll and used for cutting off the tape pulled out by the tape clamping assembly. The tape attaching equipment realizes full-automatic tape attaching, is simple to operate and is basically suitable for tape attaching of various different types of PCBs.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a PCB gold finger gluing equipment and a gluing method. Background technique [0002] In the manufacturing process of PCB board (Printed Circuit Board, printed circuit board), after the PCB board is electrically tested, the PCB board with gold fingers must be pasted with high-temperature tape during processing to protect the gold fingers, so as to prevent the gold fingers from being damaged. Oxidation or damage caused by scratches, etc. [0003] At present, sticking high-temperature tape on the golden finger of the PCB is generally done by hand or by a glue machine. Pure manual glue sticking is slow, easy to stick deviation and produce wrinkles, low glue sticking efficiency, and low sticking accuracy. At the same time, manual sticking will easily leave fingerprints and sweat stains on the board surface, causing the PCB board to be oxidized, thus affecting the fini...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/28H05K3/281
Inventor 王标
Owner 湖北兆元科技有限公司
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