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Chip-on-film binding structure, display module and terminal device

A chip-on-chip film and display module technology, which is applied in the direction of semiconductor devices, printed circuits, electrical components, etc., can solve problems that affect the yield rate and product life of module products, poor display modules, and easy corrosion, etc., to reduce display Defective, improve reliability, improve the effect of corrosion

Pending Publication Date: 2020-01-17
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the current OLED display module COF technology, the exposed part of the FPC pin is easy to corrode, which leads to bad problems in the display module, affecting the yield rate and product life of the module.

Method used

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  • Chip-on-film binding structure, display module and terminal device
  • Chip-on-film binding structure, display module and terminal device

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0032] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The invention provides a chip-on-film binding structure, a display module and a terminal device. The chip-on-film binding structure comprises a chip-on-film which comprises a first pin; and a flexiblecircuit board which comprises a second pin, wherein the second pin is connected with the first pin, the first pin comprises a first end and a second end which are opposite to each other, the second pin comprises a third end and a fourth end which are opposite to each other, and the first end of the first pin and the third end of the second pin are overlapped to form an effective contact area; thesecond end of the first pin and the fourth end of the second pin extend out of the two opposite sides of the effective contact area respectively, a first exposure area is formed at the second end ofthe first pin, and a second exposure area is formed at the fourth end of the second pin. According to the chip-on-film binding structure, the display module and the terminal device, the problem that the exposed part of the FPC pin is easy to corrode is effectively improved while the FPC and COF binding process requirements are met, the poor display of a display screen is reduced, the reliability is improved, and the service life of a product is prolonged.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a chip-on-film binding structure, a display module and terminal equipment. Background technique [0002] The current OLED (Organic Light Emitting Diode) display module process is complicated. With the increase in the diversity of functions and the reduction of its size, the laser cutting, binding and bonding of the display module are required. Higher and higher, the precision requirements of each process are getting higher and higher. [0003] Currently, OLED display modules use COF (Chip On Film, or, Chip On Flex) technology to achieve ultra-narrow bezels. The chip-on-chip technology is a technology of bonding the pads on the driver chip and the pins on the flexible circuit board through thermal compression bonding. The flexible circuit board includes a base, a metal layer, and a paint film. The paint film exposes both ends of the metal layer. One of the two exposed parts is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L27/12
CPCH01L27/1244H10K59/1315H05K1/189H05K2201/10128H10K59/131H10K59/1201
Inventor 孟欢朱潇龙黄浩
Owner BOE TECH GRP CO LTD
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