Temperature equalization component and electronic device

A technology for components and recessed parts, which is applied in the field of temperature uniform components and electronic equipment, can solve the problems of low heat dissipation efficiency of temperature uniform components, achieve the effects of reducing heat transfer efficiency factors, improving heat transfer efficiency, and reducing heat generation

Inactive Publication Date: 2020-01-17
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The application provides a temperature equalizing component and electronic equipment to solve the problem of low heat dissipation efficiency of the temperature equalizing component

Method used

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  • Temperature equalization component and electronic device
  • Temperature equalization component and electronic device
  • Temperature equalization component and electronic device

Examples

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Embodiment Construction

[0107] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0108] It should be clear that the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0109] Terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of this application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0110] It should be understood that the term "and / ...

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Abstract

The invention relates to a temperature equalization component and an electronic device. The temperature equalization component can comprise a shell and a capillary structure. The shell may include a cavity, the capillary structure is positioned in the cavity, and the shell is arranged at one side facing a heating element. The shell is provided with a first protruding part and/or a first concave part, and the direct contact between the temperature equalization component and the heating element is achieved through the first protruding part and/or the first concave part, so that the heat transferefficiency is improved, then the possibility that heat is accumulated around the heating element is reduced, and the heat dissipation effect of the temperature equalization component is improved.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, in particular to a temperature equalizing component and electronic equipment. Background technique [0002] Usually, electronic devices such as mobile phones, tablet computers, etc., are equipped with temperature equalizing components inside to dissipate heat from the heating elements of the electronic equipment. Specifically, copper blocks are arranged between the temperature equalizing components and the heating elements, and the copper blocks and The temperature equalizing part is in contact with the heating element, and the heat emitted by the heating element needs to be conducted by the copper block before it can be absorbed by the temperature equalizing part. It accumulates near the heating element and affects the normal operation of the surrounding heating element. Contents of the invention [0003] The present application provides a temperature uniform component and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20445H05K7/20336G06F1/203G06F2200/201
Inventor 孙永富施健袁志靳林芳杨杰
Owner HUAWEI TECH CO LTD
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