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Photocurable and heat curable copolymer, photosensitive resin composition, photosensitive resin film and color filter using same

A light-curing and thermal-curing technology, applied in the direction of electric solid devices, semiconductor devices, diodes, etc., can solve the problems of photosensitive resin composition not fully cured, plastic deformation, gas increase, etc., to achieve excellent thermal curability, excellent durability sexual effect

Active Publication Date: 2021-08-24
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] After development, a post-baking process applying heat of 220°C or higher is finally performed, and while glass generally used does not deform at this temperature, plastics used in flexible displays are severely deformed at temperatures above 220°C
[0006] In order to reduce such deformation of the substrate, a method of lowering the temperature of the post-baking process is used, but when the temperature of the post-baking process is lowered, the photosensitive resin composition may not be fully cured, and thus the amount of gas generated may increase, possibly Afterimages occur, and chemical resistance and heat resistance may deteriorate

Method used

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  • Photocurable and heat curable copolymer, photosensitive resin composition, photosensitive resin film and color filter using same
  • Photocurable and heat curable copolymer, photosensitive resin composition, photosensitive resin film and color filter using same
  • Photocurable and heat curable copolymer, photosensitive resin composition, photosensitive resin film and color filter using same

Examples

Experimental program
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Effect test

Synthetic example

[0162]

Synthetic example 1

[0164] 5.1% by weight of benzyl methacrylate, 0.8% by weight of N-phenylmaleimide, 0.6% by weight of styrene and 13.2% by weight of glycidyl methacrylate and 78.9% by weight of % propylene glycol methyl ether acetate (PGMEA) solvent to dissolve them, and then the temperature of the solution was raised to 75° C. under nitrogen atmosphere. When the temperature of the reactants reached 75°C, 1.2% by weight of thermal initiator V-65 was added, and then the reactants were allowed to react for 12 hours. To the obtained resin solution, a thermal polymerization inhibitor and a catalyst were added, and then 0.1% by weight of methacrylic acid was introduced under an air atmosphere, and the reactants were reacted for 16 hours while keeping the temperature at 120°C. The weight-average molecular weight of the prepared photocurable and thermally curable copolymer is 4500g / mol, and the content of (meth)acrylate repeating units substituted with epoxy groups at the end of the branched chain is...

Synthetic example 2

[0166] A photocurable and thermally curable copolymer was synthesized by the same method as in Synthesis Example 1, except that 3,4-epoxycyclohexylmethyl methacrylate was used instead of glycidyl methacrylate. The weight-average molecular weight of the prepared photocurable and thermally curable copolymer is 4700g / mol, and the content of (meth)acrylate repeating units substituted with epoxy groups at the end of the branched chain is 49mol%. The content of the (meth)acrylate repeating unit substituted with an alkenyl group at the terminal was 21 mol%.

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Abstract

The present invention relates to a photocurable and thermally curable copolymer having photosensitive resin composition, photosensitive resin film, and color filter even at relatively low temperatures, and a photosensitive resin composition using the same. Excellent thermal curability, can be photocured by light irradiation, and has excellent durability, chemical resistance, and storage stability through sufficient curing.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2017-0149676 filed with the Korean Intellectual Property Office on November 10, 2017 and Korean Patent Application No. 10-2018-0136598 filed with the Korean Intellectual Property Office on November 8, 2018 rights and interests, their disclosures are incorporated herein by reference in their entirety. [0003] The present invention relates to a photocurable and thermally curable copolymer, a photosensitive resin composition using the same, a photosensitive resin film, and a color filter. More specifically, the present invention relates to a photocurable and heat curable copolymer having excellent heat curability even at a relatively low temperature, and a photosensitive resin composition, a photosensitive resin film, and a color filter using the same. properties, can be photocured by light irradiation, and has excellent durability, chemical resist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/32C08F220/18C08F220/56C08J5/18C08F2/50H01L27/32
CPCC08F220/32C08F220/18C08F220/56C08J5/18C08F2/50C08F220/20C08F220/325
Inventor 朴惠真赵昌镐安贞爱吴美莲孙敬喆
Owner LG CHEM LTD
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