Wafer curvature adjusting device and method
A technology for adjusting device and curvature, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc. It can solve the problems of inaccurate adjustment of wafer curvature and inability to select the direction of adjustment.
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[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the specific technical solutions of the invention will be further described in detail below in conjunction with the drawings in the embodiments of the present invention. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0030] like figure 1 As shown, the X direction mentioned in the embodiments of the present invention refers to the X-axis direction of the plane where the wafer surface is located; the Y direction mentioned in the embodiments of the present invention refers to the Y-axis direction of the plane where the wafer surface is located.
[0031] In related technologies, the curvature of the wafer can be measured by wafer curvature testing equipment. Generally, the curvature of the wafer will be characterized by at least two aspects of the curvature of the wa...
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