Wafer curvature adjusting device and method

A technology for adjusting device and curvature, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc. It can solve the problems of inaccurate adjustment of wafer curvature and inability to select the direction of adjustment.

Active Publication Date: 2020-02-04
YANGTZE MEMORY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the related art, the adjustment of the curvature of the wafer can only be adjusted in units of the plane where the wafer surface is located.
The di

Method used

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  • Wafer curvature adjusting device and method
  • Wafer curvature adjusting device and method
  • Wafer curvature adjusting device and method

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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the specific technical solutions of the invention will be further described in detail below in conjunction with the drawings in the embodiments of the present invention. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0030] like figure 1 As shown, the X direction mentioned in the embodiments of the present invention refers to the X-axis direction of the plane where the wafer surface is located; the Y direction mentioned in the embodiments of the present invention refers to the Y-axis direction of the plane where the wafer surface is located.

[0031] In related technologies, the curvature of the wafer can be measured by wafer curvature testing equipment. Generally, the curvature of the wafer will be characterized by at least two aspects of the curvature of the wa...

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Abstract

The embodiment of the invention provides a wafer curvature adjusting device and method. When a film deposited on a wafer arranged on a fixing body of the wafer curvature adjusting device is etched, the etching thickness of the film deposited on the wafer in the first direction is adjusted by heating a heating component of the wafer curvature adjusting device so as to adjust the curvature of the wafer in the first direction; and the heating component is arranged on the fixing body. Therefore, the adjustment of the curvature of the wafer in the specific direction can be realized.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer curvature adjustment device and method. Background technique [0002] In the semiconductor manufacturing process, it is necessary to perform multi-layer thin film deposition processing on the front side of the wafer and perform etching processing on the deposited multi-layer thin film. These processes will cause the wafer to bend, and the excessive curvature of the wafer (expressed as bow in English) will lead to a series of adverse consequences. Therefore, controlling wafer bow within a reasonable range has huge economic benefits and research value. [0003] In related technologies, the stress of the wafer is generally improved by depositing a specific film (such as a silicon nitride film, a silicon oxide film, etc.) on the back of the wafer and etching the deposited film to adjust the curvature of the wafer. . However, in the related art, the adjustment of the...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/311
CPCH01L21/67063H01L21/67103H01L21/31111
Inventor 白靖宇
Owner YANGTZE MEMORY TECH CO LTD
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