Formation method of package structure

Abstract

A package structure and a formation method are provided. The method includes disposing a first semiconductor die over a carrier substrate and forming a first protective layer to surround the first semiconductor die. The method also includes forming a dielectric layer over the first protective layer and the first semiconductor die. The method further includes patterning the dielectric layer to forman opening partially exposing the first semiconductor die and the first protective layer. In addition, the method includes bonding a second semiconductor die to the first semiconductor die after theopening is formed. The method includes forming a second protective layer to surround the second semiconductor die.

Description

technical field [0001] Some embodiments of the present invention relate to methods of forming package structures, particularly package structures having stacked semiconductor dies. Background technique [0002] The semiconductor integrated circuit (integrated circuit, IC) industry has experienced rapid growth. Continuous progress in semiconductor manufacturing processes has produced semiconductor devices with more precise features and a high degree of integration. Functional density (ie, the number of interconnected devices per chip area) has generally increased while feature size (ie, the smallest component that can be produced using a fabrication process) has shrunk. This size reduction process generally provides advantages such as increased production efficiency and reduced associated costs. [0003] The chip package not only protects the semiconductor device from external environmental pollution, but also provides a connection interface for the semiconductor device pac...

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Problems solved by technology

These relatively new semiconductor die packaging technologies face manufacturing process challenges

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