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Circuit board cover pressing device

A pressing device and board cover technology, applied in the direction of assembly machines, metal processing, metal processing equipment, etc., can solve the problems of uneven assembly force, damage to components, deformation of circuit boards, etc., to ensure product quality and work efficiency High, avoid damage effect

Pending Publication Date: 2020-03-06
FOSHAN CHUANDONG MAGNETOELECTRICITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In traditional production, manual assembly is usually used to press the circuit board into the cover body by hand. During the pressing process, it is easy to have problems such as loose pressing and uneven assembly force, which may easily cause deformation of the circuit board and lead to components on the board. The device is damaged, affecting product quality

Method used

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  • Circuit board cover pressing device
  • Circuit board cover pressing device
  • Circuit board cover pressing device

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Embodiment Construction

[0020] The present invention provides a circuit board cover pressing device. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the protection scope of the present invention.

[0021] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; may be mechanically connected, may also be electrically connected or may communicate with each other; may be directly connected, or indirectly connected through an intermedia...

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Abstract

The invention discloses a circuit board cover pressing device. The device comprises a substrate, a base and a pressing cylinder. The pressing cylinder is vertically arranged on the substrate by a vertical supporting plate, and the output end of the pressing cylinder is arranged downwards and connected with a pressing block. The base is arranged on the substrate below the pressing block correspondingly, and the top of the base is connected with a movable panel by elastic elements. A plurality of placing grooves are formed in the movable panel, a plurality of ejecting sheet holes are uniformly formed in the bottoms of the placing grooves, a plurality of ejecting sheets are arranged at the positions, corresponding to the ejecting sheet holes, of the top of the base, and are matched with the ejecting sheet holes. By means of the arrangement, manual pressing is not required, operation efficiency is high, the stress of a circuit board is uniform in the pressing process, damage to componentsby deformation of the circuit board is avoided, and product quality is ensured.

Description

technical field [0001] The invention relates to the field of electronic device production and manufacturing, in particular to a circuit board cover pressing device. Background technique [0002] In the production process of electronic devices, it is necessary to assemble the circuit board in the cover to ensure that the circuit board and the cover are tightly assembled, such as various sensor devices. In traditional production, manual assembly is usually used to press the circuit board into the cover body by hand. During the pressing process, it is easy to have problems such as loose pressing and uneven assembly force, which may easily cause deformation of the circuit board and lead to components on the board. Devices are damaged, affecting product quality. [0003] It can be seen that the prior art still needs to be improved and enhanced. Contents of the invention [0004] In view of the deficiencies of the above-mentioned prior art, the object of the present invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P21/00B23P19/027
CPCB23P21/00B23P19/027
Inventor 夏贤冲严铭安
Owner FOSHAN CHUANDONG MAGNETOELECTRICITY
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