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Manufacturing process of circuit board with three-dimensional pattern

A production process and three-dimensional graphics technology, which is applied in the manufacturing of printed circuits, processing of insulating substrates/layers, printed circuits, etc., to achieve the effect of improving efficiency, saving consumables, and improving processing efficiency

Active Publication Date: 2020-03-06
广州陶积电电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The difficulty of making circuit boards with three-dimen

Method used

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  • Manufacturing process of circuit board with three-dimensional pattern
  • Manufacturing process of circuit board with three-dimensional pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Prepare materials, select the circuit board base material 1 that meets the requirements, the base material 1 is the whole board, draw multiple plane circuit areas 2 on the base material 1 for typesetting, and the delineated range of each plane line area 2 is an independent circuit plate. The grooved area 3 is marked between two adjacent planar circuit areas 2, and the width of the slotted area 3, that is, the distance between two adjacent planar circuit areas 2, depends on the material strength of the substrate 1 and the spacing distance of the preset circuit pattern Comprehensive assessment of other factors. In the middle of the slotting area 3, the reserved area 4 for the connection bridge is divided. After the slotting, this area is reserved as the connection bridge 6 connecting the circuit boards where the two plane line areas 2 are located, avoiding the plane cut by slotting The circuit board where the circuit area 2 is located falls off from the entire substrate ...

Embodiment 2

[0058] Prepare materials, select the circuit board base material 1 that meets the requirements, the base material 1 is the whole board, draw multiple plane circuit areas 2 on the base material 1 for typesetting, and the delineated range of each plane line area 2 is an independent circuit plate. The grooved area 3 is marked between two adjacent planar circuit areas 2, and the width of the slotted area 3, that is, the distance between two adjacent planar circuit areas 2, depends on the material strength of the substrate 1 and the spacing distance of the preset circuit pattern Comprehensive assessment of other factors. In the middle of the slotting area 3, the reserved area 4 for the connection bridge is divided. After the slotting, this area is reserved as the connection bridge 6 connecting the circuit boards where the two plane line areas 2 are located, avoiding the plane cut by slotting The circuit board where the circuit area 2 is located falls off from the entire substrate ...

Embodiment 3

[0067] Prepare materials, select the circuit board base material 1 that meets the requirements, the base material 1 is the whole board, draw multiple plane circuit areas 2 on the base material 1 for typesetting, and the delineated range of each plane line area 2 is an independent circuit plate. The grooved area 3 is marked between two adjacent planar circuit areas 2, and the width of the slotted area 3, that is, the distance between two adjacent planar circuit areas 2, depends on the material strength of the substrate 1 and the spacing distance of the preset circuit pattern Comprehensive assessment of other factors. In the middle of the slotting area 3, the reserved area 4 for the connection bridge is divided. After the slotting, this area is reserved as the connection bridge 6 connecting the circuit boards where the two plane line areas 2 are located, avoiding the plane cut by slotting The circuit board where the circuit area 2 is located falls off from the entire substrate ...

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PUM

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Abstract

The invention relates to a manufacturing process of a circuit board with a three-dimensional pattern. The manufacturing process comprises the following steps of: selecting a circuit board substrate, and marking a plane circuit area, a slotting area and a connecting bridge reserved area on the surface of the substrate through scribing; carrying out slotting and processing on the slotting area calibrated on the surface of the substrate, and forming a side vertical surface circuit area on the section of the substrate; carrying out chamfering treatment on the edges through machining; arranging a metal layer on the surface of the insulating layer of the substrate through a physical or chemical process; continuously thickening a copper layer on the surface of the metal layer through a copper plating process; simultaneously drawing patterns required by a planar circuit area and the side vertical surface circuit area on the film, simultaneously covering the surfaces of the planar circuit areaand the side vertical surface circuit area with the film, and completing the manufacturing of the circuit patterns through exposure, development, etching and film stripping processes; and cutting thereserved area of the connecting bridge. Metallization and patterning of multiple surfaces can be completed through one-time manufacturing, consumables of a film exposure and development process are reduced, and meanwhile, the processing efficiency is improved.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a manufacturing process of a circuit board with three-dimensional graphics. Background technique [0002] The circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Almost all electronic equipment is inseparable from circuit boards, from electronic watches, general-purpose computers, televisions, to supercomputers, communication electronic equipment, military weapon systems, etc., as long as there are electronic components such as integrated circuits, they are electrically interconnected Circuit boards are used. [0003] The circuit board with three-dimensional graphics, in addition to the circuit graphics on the front and back, will also form circuit graphics on the side elevation of the circuit board for conduction or welding. The difficulty in making circuit boards ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/14
CPCH05K1/14H05K3/0044H05K3/0052
Inventor 徐朝晨徐上廷钟鸿枫钟少瑛
Owner 广州陶积电电子科技有限公司