Evaluation method, device and terminal equipment based on semiconductor measurement parameters

Abstract

The present invention proposes an evaluation method, device and terminal equipment based on semiconductor measurement parameters, wherein the method includes: acquiring product sample data of multiple production equipment, and the product sample data is based on the same semiconductor measurement parameter; Product sample data, calculate the probability distribution quantile and probability distribution percentage corresponding to each product sample data of the production equipment; draw the production equipment difference analysis diagram according to the calculated data; where, the production equipment difference analysis diagram includes the first horizontal axis, the first vertical axis and the second vertical axis; the first horizontal axis represents the product sample data, the first vertical axis represents the probability distribution percentage corresponding to the product sample data, and the second vertical axis represents the probability distribution quantile corresponding to the product sample data ; and evaluate the differences among multiple production equipments according to the production equipment variance analysis diagram. With the present invention, it is possible to evaluate the differences among multiple production equipment based on the same semiconductor measurement parameter.

Description

technical field [0001] The present invention relates to the field of computer technology, in particular to an evaluation method, device and terminal equipment based on semiconductor measurement parameters. Background technique [0002] In production manufacturing, the process of creating a product involves multiple process stations. When producing products in batches, each process site can use multiple machines (also called machines or equipment) for batch production. [0003] When performing differential data analysis on multiple devices at the same process site, a special chart is generally used to compare the differences between devices under the preset probability distribution, which helps to quickly and conveniently know the difference between devices when matching devices difference. For example, if figure 1 As shown, it represents a boxplot of the film thickness distribution of the semiconductor device generated by the machines 1 to 5 performing the work of the pro...

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide an evaluation method, device, storage medium and terminal equipment based on semiconductor measurement parameters to solve or alleviate one or more of the above technical problems in the prior art

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