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Semiconductor device

A semiconductor and device technology, applied in the field of semiconductor devices, can solve problems such as fluctuations

Pending Publication Date: 2020-03-10
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of polysilicon resistors is that polysilicon resistors can be formed without complicating the manufacturing process of semiconductor devices, and high resistance can be achieved with high resistivity and small area, but the resistance value is known after the molding packaging process fluctuation

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

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Embodiment Construction

[0028] Embodiments are described below with reference to the drawings. figure 1 A semiconductor device 1 according to the present embodiment is shown. Active elements such as transistors and passive elements such as resistors and capacitors are formed on the substrate of the semiconductor device 1 . These elements are used to form various functional blocks in the semiconductor device 1 . As an example of a function block, figure 1 A CPU (Central Processing Unit) 2 , RAM 3 , peripheral IP 4 , and nonvolatile memory 5 are shown. Peripheral IP can be, for example, an A / D converter. Addresses and data are exchanged between these functional blocks via the bus 10 . The clock generation circuit 7 generates a clock from an oscillation signal of an on-chip oscillator contained therein, and distributes the clock to these functional clocks through the bus 10 . As described in detail later, the on-chip oscillator has trimming resistors. By setting the resistance value of the trimm...

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Abstract

The embodiments of the disclosure relates to a semiconductor device. The polysilicon resistance has a large resistance variation rate after the end of the mold packaging process. In order to enable high-precision trimming, it is desired to realize a resistance which is hardly affected by stress and temperature fluctuation generated in a substrate by a mold packaging process. A resistance element is formed in a plurality of wiring layers, and has a first conductive layer formed in a first wiring layer, a second conductive layer formed in a second wiring layer, and a repeating pattern of an interlayer conductive layer connecting the first conductive layer and the second conductive layer, and the interlayer conductive layer is formed of a plurality of types of materials.

Description

[0001] Cross References to Related Applications [0002] The disclosure of Japanese Patent Application No. 2018-161311 filed on August 30, 2018 including specification, drawings and abstract is incorporated herein by reference in its entirety. technical field [0003] The present disclosure relates to a semiconductor device having a resistance element formed in a wiring layer. Background technique [0004] In the case where an oscillation circuit is provided in a semiconductor device, a trimming circuit for finely adjusting the frequency characteristics of the oscillation circuit is generally provided. The trimming circuit has a resistor, and by adjusting the resistance value of the resistor, the oscillation frequency of the oscillation circuit can be set to a desired value for each semiconductor device. Polysilicon resistors used to form circuit elements such as transistors are known as resistive elements for trimming circuits. The advantage of polysilicon resistors is t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/522H03K3/011H10N97/00
CPCH01L28/20H01L23/5228H03K3/011G01L1/2281H01L27/0802H03K3/0231G01L1/2287
Inventor 桥本千惠美矢山浩辅松崎智一
Owner RENESAS ELECTRONICS CORP