Packaging device and packaging method for performing composite packaging test
A packaging device, packaging and testing technology, applied in electronic circuit testing, instruments, measuring electricity and other directions, can solve the problems of high cost and long packaging time, and achieve the effect of reducing costs
Pending Publication Date: 2020-03-13
FOSHAN NATIONSTAR SEMICON
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Traditional packaging adopts different packaging forms according to different chips and different applications. Correspondingly, different material boxes, die-bonding fixtures, wire bonding fixtures, sealing machine fixtures, and test fixtures must be used according to different brackets. Use different die bonding machines and wire bonding machines, so for product development and verification, there are many types of materials and fixtures, high cost and long packaging time
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0031] see figure 1 , a packaging device for composite packaging testing provided by the present invention, including a chip 1 , a packaging substrate 2 and an optical lens 3 .
[0032] Specifically, the chip 1 is fixed on the packaging substrate 2 . Wherein, the packaging substrate 2 is provided with pads, and the chip is electrically connected to the pads through bonding wires.
[0033] In addition, the packaging substrate is provided with a four-pin or six-pin power-on structure, which can be used for common-cathode power-on or parallel-connection power-on of the three-color tubes. The above-mentioned energization structure is the energization structure of a conventional packaging substrate, which is not specifically limited in the present invention.
[0034...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| transmittivity | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a packaging device and a packaging method for performing a composite packaging test. The packaging device comprises chips, a packaging substrate and optical lenses. The chips are fixed on the packaging substrate. The packaging substrate is provided with a plurality of slots with different sizes, and the optical lenses are inserted into the corresponding slots to cover the chips. Light required by testing is obtained after light emitted by the chips passes through the optical lenses. According to the packaging device, chips of different sizes can be packaged through cooperation of the packaging substrate and the optical lenses, testing can be carried out only by clamping the packaging substrate through one clamp, and the cost is reduced.
Description
technical field [0001] The invention relates to the technical field of light-emitting diode packaging, in particular to a packaging device and a packaging method for composite packaging testing. Background technique [0002] After the LED chip is manufactured, it needs to be packaged and tested to determine the photoelectric performance of the LED chip. Traditional packaging adopts different packaging forms according to different chips and different applications. Correspondingly, different material boxes, die-bonding fixtures, wire bonding fixtures, sealing machine fixtures, and test fixtures must be used according to different brackets. Different crystal bonders and wire bonders are used, so for product development and verification, there are many types of materials and fixtures, high cost and long packaging time. [0003] Such as figure 1 As shown, the existing packaging methods generally include SMD, SMT, LAMP, and COB, and the brackets, material boxes, die-bonding fixt...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2896
Inventor 余金隆庄家铭
Owner FOSHAN NATIONSTAR SEMICON