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Cleaning method of integrated circuit board

A technology for integrated circuit boards and cleaning fluids, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., and can solve problems that affect device performance, device failure, and poor cleaning effects, etc.

Pending Publication Date: 2020-03-17
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the preparation of integrated circuits, pollutants such as particles, organic matter and metals adhering to the surface of the integrated circuit board seriously affect the performance of the device, so it is necessary to clean the integrated circuit board, but the existing cleaning technology for integrated circuit boards has cleaning Poor effect leads to device failure

Method used

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  • Cleaning method of integrated circuit board

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] see figure 1 , a method for cleaning an integrated circuit board according to a preferred embodiment of the present invention, comprising steps S11 to S15:

[0020] S11, using compressed air to blow off the dust adhering to the surface of the integrated circuit board.

[0021] In the embodiment of the present invention, compressed air is used to blow off the dust adhering to the surface of the integrated circuit board, so that the surface of the integrated ...

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PUM

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Abstract

The invention relates to the technical field of circuit boards, anddiscloses a cleaning method of an integrated circuit board. Firstly, compressed air is used for blowing away dust adhering to the surface of the integrated circuit board, and then the surface of the integrated circuit can be fully cleaned in the subsequent cleaning procedure; the integrated circuit board is soaked in a first cleaning solution for ultrasonic cleaning, wherein the first cleaning solution comprises chloroform and alcohol; then the integrated circuit board is washed with first pure water, then the integrated circuit board is blow-dried with compressed air, then the integrated circuit board is subjected to spray cleaning with a second cleaning solution, wherein the second cleaning solution comprises sulfuric acid, hydrogen peroxide and water; and finally, the integrated circuit board is washed with second pure water and then dried, so that the cleaned integrated circuit board is obtained, pollutants such asparticles, organic matter and metal on the surface of the integrated circuit board are removed, and the surface cleanliness of the integrated circuit board is ensured.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a cleaning method for integrated circuit boards. Background technique [0002] At present, integrated circuits are the core components of electronic products, and their quality directly determines the performance and reliability of electronic products. During the preparation of integrated circuits, pollutants such as particles, organic matter and metals adhering to the surface of the integrated circuit board seriously affect the performance of the device, so it is necessary to clean the integrated circuit board, but the existing cleaning technology for integrated circuit boards has cleaning Poor results lead to device failure. Contents of the invention [0003] The object of the present invention is to provide a cleaning method for an integrated circuit board, which can effectively clean the integrated circuit board. [0004] In order to solve the above-mentioned techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02057
Inventor 张建
Owner SAE TECH DELEVOPMENT DONGGUAN
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