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A kind of cyanide-free alkali copper electroplating solution and using method thereof
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A technology of electroplating solution and alkali copper, which is applied in the field of cyanide-free alkali copper electroplating solution, can solve the problems of replacing copper and not solving the problems of cyanide-free alkaline copper plating solution, and achieves easy operation, improved electrodeposition rate, and coating bonding force Good results
Active Publication Date: 2021-04-06
GUANGZHOU SANFU NEW MATERIALS TECH
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But this invention does not solve the problem that the cyanide-free alkaline copper plating solution is easy to replace copper
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Embodiment 1-6
[0036]Example 1-6, cyanocyanocyano-alkali solution and method thereof
[0037]The formulations of the cyanopcharilized alkali solution in Examples 1-6 are shown in the following table.
[0038]Table 1
[0039]
Embodiment 1
[0040]The method of use of the cyanocyanized alkali solution in Example 1 is as follows:
[0041]S1. Configuration of Electroplating Solution: Take the citrate, auxiliary complexing agent, conductive salt, and the brightener to add a tap water that accounted for about 2 / 3 of the overall, and the pH regulator and the divalent copper ionic compound are stirred and sufficiently dissolved. Rong, that is, the plating solution;
[0042]S2. Plating Pretreatment: Wash the steel plating unit, chemically remove oil, hot water, pickling, and water cleaning step;
[0043]S3. Electroplating: A copper sheet is an anode, to be a cathode to be plated, adding plating solution, at the current density of 1.5A / DM2, Temperature is 35 ° C, electroplated for 10 min, which is copper-plated.
Embodiment 2
[0044]Example 2 The method of use of a cyanotic alkali solution refers to Example 1, which distinguishes the plating parts used as aluminum alloys.
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Abstract
The invention belongs to the technical field of electroplating, and in particular relates to a cyanide-free alkali copper electroplating solution and a using method thereof. The cyanide-free alkali copper electroplating solution includes divalent copper ion 5-8g / L, citrate 75-85g / L, auxiliary complexing agent 15-25g / L, conductive salt 25-35g / L, pH regulator 8- 15g / L, brightener 0.5‑1.5g / L, wherein the auxiliary complexing agent is a mixture of organic amine compounds and polyhydroxy carboxylic acid compounds. By optimizing the complexing agent, the copper plating solution obtained by the present invention will not have copper powder precipitated during the electroplating process, the electrodeposition speed of electroplated copper is improved, the obtained coating is fine and uniform, the coating has good bonding force, and can be electroplated on steel, brass, etc. Various castings such as copper, aluminum alloy and zinc die castings are beneficial to industrial production.
Description
Technical field[0001]The present invention belongs to the field of electroplating, and more particularly to a cyano-cyanine copper plating solution and method thereof.Background technique[0002]Copper is a good ductility, high thermal conductivity, good stability, high stability, and carries it uniformly plated in various material surfaces using plating process, and can be used as a protective decorative coating, pre-plated intermediate layer , Circuit plating, etc., which functions as decoration, conductive, thermally conductive, pre-plated. Copper plated into two categories of cyanide copper plating and cyanogenous copper plating. Cyanide copper-plated solution is well stability, good copper plating capacity, fast deposition speed, good dispersibility, low plating porosity, good anodic solubility, no copper powder, coating quality, but cyanide is a highly toxic Materials and production process will produce a large number of cyanide wastewater, exhaust gas and waste residue, bring s...
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