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Multi-chip intelligent card pressure head and chip packaging equipment

A pressure head, smart card technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of pressure head fine-tuning, low efficiency, large footprint, etc., to achieve precise alignment and high efficiency.

Pending Publication Date: 2020-03-27
EASTCOMPEACE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It can be seen from the above that this process has very high requirements on the pressing accuracy of the hot press station and the cold press station. At present, once the pressure head is installed on the hot press station / cold press station, it is difficult to fine-tune the position of the pressure head. If the alignment chip of the pressure head is inaccurate, usually only the entire hot press station / cold press station can be adjusted, and the adjustment work is very cumbersome
[0004] In addition, with the development of smart card technology, there are more and more types of smart cards. Some products have multiple chips on one card body, but the hot-pressing station or cold-pressing station on the existing packaging chip equipment can only process one chip at a time. Chips are processed, resulting in the same process requiring multiple hot-pressing stations and multiple cold-pressing stations to complete the processing at the same time. The efficiency is low, the production capacity of the equipment is low, and the floor space is also large.

Method used

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  • Multi-chip intelligent card pressure head and chip packaging equipment
  • Multi-chip intelligent card pressure head and chip packaging equipment
  • Multi-chip intelligent card pressure head and chip packaging equipment

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Embodiment Construction

[0020] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0021] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific ...

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PUM

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Abstract

The invention discloses a multi-chip intelligent card pressure head, which comprises a pressure head body, at least two chip pressure heads distributed on the lower side of the pressure head body; a sliding part used for being connected with a cold pressing station or a hot pressing station in a sliding mode and located on the upper side of the pressure head body; and a mounting hole which penetrates through the pressure head body front and back, and a fastener which penetrates through the mounting hole to be connected with the cold pressing station or the hot pressing station. The inventiondiscloses chip packaging equipment which comprises the cold pressing station and the hot pressing station, and pressure heads are mounted on the cold pressing station and the hot pressing station. Thelower side of the pressure head body is provided with at least two chip pressure heads. A plurality of chips can be processed at the same time by one-time pressing of the pressure head. The efficiency is very high, the sliding piece can adjust the position of the pressure head body relative to the cold pressing station or the hot pressing station in a sliding mode, the pressure head body penetrates through the installation hole through the fastener and is locked on the cold pressing station or the hot pressing station, and therefore the position of the pressure head can be effectively and finely adjusted, and accurate alignment with the chips is achieved.

Description

technical field [0001] The invention relates to chip smart card manufacturing equipment, in particular to a multi-chip smart card pressure head and packaging chip equipment. Background technique [0002] The process of chip smart card processing needs to involve the chip packaging process. The chip packaging process needs to use chip packaging equipment to package the chip on the smart card. The core components of the chip packaging equipment are hot press station and cold press station, hot press station and cold press station. The pressure head is installed on the top, the hot pressing station can heat press the chip onto the smart card through the pressure head, and the cold pressing station can cool down the chip by pressing down the pressure head in time. [0003] It can be seen from the above that this process has very high requirements on the pressing accuracy of the hot press station and the cold press station. At present, once the pressure head is installed on the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 何思博李梅芬程治国
Owner EASTCOMPEACE TECH