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Laser processing equipment and taper improving method

A technology of laser processing and equipment, applied in laser welding equipment, metal processing equipment, welding equipment and other directions, can solve the problems of inconsistent cutting depth, high development cost, adding parts, etc., to improve processing quality, reduce development cost, and improve taper effect of the problem

Pending Publication Date: 2020-12-11
SHANGHAI INST OF LASER TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] to combine Figure 4 As shown, for the existing laser processing technology, the energy distribution of the laser beam is Gaussian distribution. After reaching the working surface, due to its spot characteristics, after the laser beam cuts the processing section of the material to be processed, it is easy to form a certain The processing taper causes the cutting depth of the upper and lower processing surfaces of the processed material to be inconsistent, which affects the processing quality
In the existing technology, the method of optimizing the optical path and changing the characteristics of the spot is used to improve the taper of the processing surface, which requires additional components, and the high development cost also increases the complexity of the system.

Method used

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  • Laser processing equipment and taper improving method
  • Laser processing equipment and taper improving method
  • Laser processing equipment and taper improving method

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Embodiment Construction

[0040] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description, the purpose, technical solution and advantages of the present invention will be more clear. It should be noted that the described embodiments are preferred embodiments of the present invention, but not all embodiments.

[0041] to combine figure 1 As shown, a laser processing equipment includes a laser module 130, an optical path module 200, a laser scanning module 140, a precision motion platform, an alignment module 400 and a control unit.

[0042] The laser module 130 generates a laser beam used for processing, the laser module 130 is preferably a femtosecond laser, and the laser beam is a Gaussian laser. The optical path module 200 is used to shape the laser beam and change the propagation path of the laser beam, and the laser beam enters the laser scanning module after passing through the ...

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Abstract

The invention relates to laser processing equipment which comprises a laser module, a light path module, a laser scanning module, a precision moving table, an alignment module and a control unit. Theinvention further discloses a taper improving method based on the laser processing equipment. The taper improving method comprises three steps. According to the laser processing equipment and the taper improving method, the laser processing technology is optimized through inward arc swing movement of the moving table at a certain angle in the vertical plane, the taper problem in laser processing can be effectively solved, and the processing quality of materials to be processed is improved. Compared with a method of optimizing a light path and changing the characteristics of light spots, the complexity of system design can be reduced, and the system development cost is reduced.

Description

technical field [0001] The invention relates to laser processing equipment and a method for improving taper, belonging to the technical field of laser processing. Background technique [0002] Laser processing is the use of high-power-density laser beams to irradiate the material to be cut, so that the material is quickly heated to the vaporization temperature, evaporates to form holes, and as the beam moves to the material, the holes continuously form narrow slits to complete the cutting of the material. cutting. [0003] to combine Figure 4 As shown, for the existing laser processing technology, the energy distribution of the laser beam is Gaussian distribution. After reaching the working surface, due to its spot characteristics, after the laser beam cuts the processing section of the material to be processed, it is easy to form a certain The processing taper causes the cutting depth of the upper and lower processing surfaces of the processed material to be inconsistent,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/082B23K26/70
CPCB23K26/38B23K26/082B23K26/702
Inventor 刘志宇王丽骆公序汪于涛
Owner SHANGHAI INST OF LASER TECH