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Edge photoresist removal system and method of treating substrate

An edge light, resist technology, applied in optics, opto-mechanical equipment, photosensitive material processing, etc., can solve problems such as inaccuracy

Pending Publication Date: 2020-03-31
苏斯微技术光刻有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] To date, either a macro needle for solvent dispensing was used to remove the coating photoresist, but this is not accurate when the wafer is bent

Method used

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  • Edge photoresist removal system and method of treating substrate
  • Edge photoresist removal system and method of treating substrate

Examples

Experimental program
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Embodiment Construction

[0048] exist figure 1 In , an edge photoresist removal system 10 for processing a substrate 12 is shown.

[0049] The edge photoresist removal system 10 includes a chamber 14 in which is positioned an edge photoresist removal chuck 16 having a processing surface 18 on which a substrate 12 is placed. The above is processed by the edge photoresist removal system 10 .

[0050] Additionally, the edge photoresist removal system 10 includes an edge photoresist removal head 20 also located within the chamber 14 . The edge photoresist removal head 20 has a main body 22 and two arms 24 protruding from the main body 22 . The arms 24 are spaced apart from each other in a vertical direction V perpendicular to the horizontal direction H. As shown in FIG.

[0051] The vertical direction V and the horizontal direction H are in figure 1 are illustrated in the separate figures shown in .

[0052] In fact, if figure 1 As shown in FIG. 3 , edge photoresist removal head 20 is substantially ...

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Abstract

An edge photoresist removal system for treating a substrate is described, which includes an edge photoresist removal head with a main body (22) and two arms (24) protruding from the main body (22). The arms (24) are distanced from each other defining a reception space (26) between them for accommodating a substrate (12) to be treated. The protruding arms (24) each have a functional surface (36) facing each other, and wherein the functional surfaces (36) each have at least one fluid outlet (38). Further, a method of treating a substrate (12) is described.

Description

technical field [0001] The present invention relates to an edge bead removal system for processing a substrate. Furthermore, the invention relates to a method of processing a substrate. Background technique [0002] The invention relates in particular to the production of microstructured components by means of photolithography. Microstructural components are in particular integrated surfaces, semiconductor chips or microelectromechanical systems (MEMS). A substrate, also called a wafer, is used in a photolithographic process, where the substrate is coated with a photoresist, also called a resist. The coated substrate is then exposed via a mask, wherein the physical and / or chemical properties of the photoresist are partially altered by the exposure. [0003] Typically, the photoresist is applied in a layer on the substrate, where it is important that the applied photoresist layer is free of irregularities or grains. Therefore, the photoresist is especially applied during ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/42
CPCG03F7/162G03F7/168H01L21/6708G03F7/42H01L21/02096H01L21/02057H01L21/67028H01L21/6715
Inventor 鲁多维奇·拉塔德赖纳·泰格斯
Owner 苏斯微技术光刻有限公司