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A dual ring susceptor for semiconductor epitaxy system

A semiconductor, double-loop technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the inability to guarantee the accuracy of substrate placement, achieve smooth movement, reduce shaking and collision, and improve accuracy.

Pending Publication Date: 2020-03-31
ZHEJIANG QIUSHI SEMICON EQUIP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when handling large-size substrates, due to the instability of the Bernoulli rods and the excessive distance between the base and the Bernoulli rods that carry the substrates, the substrates will shake and collide when they are placed, and the placement cannot be guaranteed. Substrate Accuracy

Method used

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  • A dual ring susceptor for semiconductor epitaxy system
  • A dual ring susceptor for semiconductor epitaxy system
  • A dual ring susceptor for semiconductor epitaxy system

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Embodiment Construction

[0020] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, and analyze the advantages of the present invention, a further understanding of the present invention can be obtained by referring to the detailed description of the present invention combined with the accompanying drawings and specific implementation methods.

[0021] attached figure 1 The bottom view of the inner and outer ring bases in the embodiment of the present invention, the inner and outer double ring bases used in the present invention include: an inner ring base 1 and an outer ring base 2, the inner ring base 1 includes a disc main body, The lower end surface of the disc is provided with a coaxial boss, the outer ring base 2 is in the shape of a ring, the inner side of the outer ring base 2 is provided with a stepped boundary, and the inner ring base 1 is built in, so that the overall double-ring base is in the shape of a disc. ty...

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Abstract

The invention relates to the field of semiconductor epitaxy equipment, in particular to a double-ring type base for a semiconductor epitaxy system. The inner ring comprises an inner ring base, a mainbody of the inner ring base is of a disc structure, and a coaxial boss is arranged on the lower end face of the disc structure; the outer ring base is of an annular structure, a step is arranged on the inner edge of the outer ring base, and the boss on the inner ring base is matched with the step on the inner edge of the outer ring base in shape, so that the inner ring base is embedded in the outer ring base; the lower end face of the inner ring base is connected with a lifting mechanism through an inner ring supporting device. The lower end face of the outer ring base is connected with a rotating mechanism through an outer ring supporting device. According to the invention, the substrate placing action is stable, shaking and collision in the substrate placing process are reduced, and thesubstrate placing accuracy is improved; the outer ring base drives the inner ring base to form a synchronous constant-speed rotating structure, so that the substrate rotates at a constant speed in theheating process of the heating light source, the epitaxial growth of the substrate is more uniform, Meanwhile, the smoothness and flatness of a non-machined surface can be ensured.

Description

technical field [0001] The invention relates to the field of designing semiconductor epitaxy equipment, in particular to a design of a double-ring base for carrying substrates. Background technique [0002] At present, as an epitaxial growth device for growing an epitaxial film on a substrate, there is generally a rotatable base for supporting the substrate provided in the process chamber. In this device, the currently used The pick-up device of the Bernoulli rod transports the substrate. However, when handling large-sized substrates, due to the instability of the Bernoulli rods and the excessive distance between the base and the Bernoulli rods that carry the substrates, the substrates will shake and collide when they are placed, and the placement cannot be guaranteed. Substrate accuracy. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a double-ring susceptor for semiconductor epitaxy system by overcoming the d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/68742H01L21/68785H01L21/68792
Inventor 沈文杰朱亮董医芳祝广辉汤承伟俞城麻鹏达周航章杰峰
Owner ZHEJIANG QIUSHI SEMICON EQUIP CO LTD