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LTCC substrate brazing method

A brazing method and substrate technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of poor brazing rate, difficult to fill with solder, flux and gas accumulation area, etc., and achieve a simple process method. Effect

Pending Publication Date: 2020-04-07
INST OF ELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For the LTCC substrate with a cavity, due to the slight protrusion of the cavity, not only is it difficult to fill the solder, but it is also easy to become a gathering area for flux and gas. Therefore, the penetration of the cavity obtained by the traditional substrate welding process The efficiency is often poor, and it is difficult to meet the needs of grounding and heat dissipation

Method used

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Embodiment Construction

[0031] Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only and are not intended to limit the scope of the present invention. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the invention. It may be evident, however, that one or more embodiments may be practiced without these specific details. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.

[0032] The terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the invention. The terms "comprising", "comprising", etc. used herein indicate the presence of stated features, steps, operations and / ...

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Abstract

The invention provides an LTCC substrate brazing method. An LTCC substrate comprises a cavity. The method comprises the steps: pre-welding is carried out on a to-be-welded surface of the LTCC substrate, and the pre-welding comprises the step of welding a first welding piece on the to-be-welded surface corresponding to the position of the cavity in a reflow welding mode; and the LTCC substrate which already completes pre-welding, a second welding piece and the shell is brazed. The overall brazing penetration rate of the LTCC substrate and the brazing penetration rate of the cavity part are improved.

Description

technical field [0001] The invention relates to the field, in particular to a method for brazing LTCC substrates. Background technique [0002] Microwave components, as the core components of active phased array antennas, have developed rapidly in recent years. In order to further improve the integration density and reliability of microwave components, multilayer ceramic substrates represented by low temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC) are more and more widely used in microwave components. A major advantage of LTCC substrate technology is that it can realize a cavity structure, that is, the bare chip is placed in the cavity, and the interconnection of the circuit is realized through the inner layer wiring of the substrate, thereby effectively improving the assembly density and extending the traditional planar 2D packaging to 2.5 The D package has been widely used in the field of microwave circuits. [0003] Under normal circumstances, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008
CPCB23K1/008
Inventor 王松陈萍霍锐贺颖刘骁
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
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