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Wave-soldering selective spraying process

A selective, wave soldering technology, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as waste

Inactive Publication Date: 2020-04-07
嘉兴光弘科技电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Taking the above-mentioned utility model patent as an example, most of the existing wave soldering technologies use all-soldering technology, which causes a lot of waste except for wave soldering at the required positions.

Method used

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Examples

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Embodiment Construction

[0034] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0035] In the preferred embodiment of the present invention, those skilled in the art should note that the camera, flux, etc. involved in the present invention can be regarded as prior art.

[0036] preferred embodiment.

[0037] The invention discloses a wave soldering selective spraying process, comprising the following steps:

[0038] Step S1: Use a camera to take photos of the produced products or jigs;

[0039] Step S2: Import the photos taken by ...

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PUM

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Abstract

The invention discloses a wave-soldering selective spraying process. The process comprises steps of S1, shooting a produced product or jig by adopting a camera; S2, importing a picture shot by the camera into a computer of a control machine table for processing; S3, opening the processed picture in software and selecting a spraying path; S4, controlling a machine table for spraying scaling powderaccording to the spraying path; and S5, controlling the machine table for conducting wave soldering on the position where the scaling powder is sprayed. The process is advantaged in that a dynamic positioning function can be achieved for spraying in the selected area.

Description

technical field [0001] The invention belongs to the technical field of wave soldering, in particular to a selective spraying process for wave soldering. Background technique [0002] The publication number is CN203209819U, and the subject name is a utility model patent for a wave soldering flux spray system. , the spray device includes a spray unit, a power unit, a fixed guide rail and a slider, the power unit is provided on the outside of the spray unit, the fixed guide rail is provided at one end of the power unit, and the fixed guide rail is set on the fixed guide rail. To fix the slider of the spray unit, the power device is connected to the slider, the power device is used to drive the slider to slide along the fixed guide rail, and the power device is controlled by a PLC control system ". [0003] Taking the above-mentioned utility model patent as an example, most of the existing wave soldering technologies adopt the all-soldering technology, which causes a lot of wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/08B23K3/08
CPCB23K1/085B23K3/08
Inventor 杜平倪国明陆建华刘子规
Owner 嘉兴光弘科技电子有限公司