Full-color LED array device integrated manufacturing method

A technology of LED array and manufacturing method, which is applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of difficult to reach array pixel spacing and low work efficiency, achieve high resolution, avoid process difficulties, and reduce process preparation the effect of time

Active Publication Date: 2020-04-07
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

Usually, traditional full-color LED array devices are integrated using splicing technology. A single pixel is extracted by a robotic arm and placed on a circuit substrate. Due to the influence of electrode leads and mechanical precision, it is difficult to achieve an array pixel pitch within 20 microns.
At the same time, the work efficiency is relatively low in the way of single placement and integration

Method used

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  • Full-color LED array device integrated manufacturing method
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  • Full-color LED array device integrated manufacturing method

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Embodiment Construction

[0046] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0047] The terms "first", "second", "third", "fourth" and the like in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily to describe specific sequence or sequence. It is to be understood that the terms so used are interchangeable under appropriate circums...

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Abstract

The invention discloses a full-color LED array device integrated manufacturing method. A stacking and integration mode is adopted, and red and green pixels and red and blue pixels are overlapped without spacing, so that the preparation of a full-color array device with higher resolution is realized; besides, the photosyntheticity of the red, green and blue three-color pixel units of a panchromaticarray is optimized by adopting a superposition integration mode; the display characteristic of the micro full-color LED array device is further improved; and moreover, according to the manufacturingmethod disclosed by the invention, the pixel spacing can be properly adjusted to meet different application requirements, the process difficulty that the pixel unit spacing cannot be reduced due to the fact that an electrode lead occupies space is avoided, red, green and blue pixel units are transferred to a circuit substrate in batches, and the process preparation time is shortened.

Description

technical field [0001] The invention relates to the field of semiconductor optoelectronic technology, in particular to an integrated manufacturing method of a full-color LED array device. Background technique [0002] LED has the characteristics of long working life, high luminance, and strong pressure resistance. It has become a new generation of solid-state lighting energy and is widely used in all-weather outdoor display, visible light communication, medical lighting and other fields. The light emission spectrum of the full-color array device can cover the range of visible light bands. Compared with the monochromatic LED array device, it can provide a more realistic picture display and further improve the display performance of the LED array device. In addition to the working performance of conventional size LED array devices, micro LED array devices can also achieve high resolution and high modulation bandwidth. Display and optical signal transmission can be carried out...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L33/00
CPCH01L27/156H01L33/0095
Inventor 班章李晓波
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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