Method for producing conductive particles and conductive particles produced by the method

Abstract

This invention relates to the manufacturing method of electroconductive particle, and the electroconductive particle manufactured by this method. The manufacturing method of distributing a plurality of conductive particles to form a conductive part for electrical connection in an elastic insulating substance includes: (a) a step of preparing a substrate; The step of forming the grooves of the conductive particles in the shape corresponding to the particles; (c) the step of filling the inside of the grooves for forming the conductive particles with metal powder; (d) heating the metal powder to produce a solid and (e) separating the solidified conductive particles from the substrate.

Description

technical field [0001] The present invention relates to a method for producing conductive particles and conductive particles produced by the production method. More specifically, it relates to a method for producing conductive particles with a small size through an accurate and simple process. A manufacturing method and the electroconductive particle manufactured by this manufacturing method. Background technique [0002] Generally, electronic components such as semiconductor integrated circuits and semiconductor packages, or circuit boards constituting or mounting such electronic components need to be inspected for electrical characteristics after manufacture. In order to inspect the electrical characteristics of such a device to be inspected, the device to be inspected and an inspection device (test board) need to be electrically connected stably, and a connector for electrical connection is used for this purpose. That is, the function of the connector device for electric...

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Problems solved by technology

Such common conductive particles not only do not have precise shape, but also do not have the shape and shape expected by the designer, so it has the disadvantage of being difficult to achieve the desired function.

[0012] In particular, the usual method of producing conductive particles utilizes water atomization, spraying (Atomizing), electroplating, etc., and the conductive particles produced by this production method have the following problems: their shape and size are very uneven, except for spherical, It is almost impossible to consistently make the desired shape

[0018] The manufacturing process of the conductive particles of this prior art is to make the mold for forming the conductive particles into a dry film. In order to obtain the conductive particles, the dry film needs to be dissolved and removed, so there is a need to bond a brand new dry film to the substrate every time. The problem

[0019] In addition, it is necessary to use a photoresist process to form a specific pattern on the dry film that is in contact with the substrate, so it has the disadvantage of incurring more costs in the steps of making the mold

[0020] In addition, the conventional method for producing conductive particles utilizes a plating process for producing conductive particles, so there is a disadvantage that the greater the thickness of the metal particles, the more plating time is required.

[0021] In addition, due to the use of the plating process, there are disadvantages as follows: In order to fix the thickness of each conductive particle after plating, the upper surface needs to be polished by a chemical mechanical polishing (CMP) process.

[0022] In addition, in order to separate conductive particles from the substrate and dry film, methods such as dissolution are used. During this process, the dry film is not completely dissolved, so it has the disadvantage of being difficult to separate.

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