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A method for manufacturing circuit board with spot plating pattern

A manufacturing method and circuit board technology, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, and can solve problems such as ineffective filling

Active Publication Date: 2021-05-11
珠海杰赛科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, the present invention proposes a method for manufacturing circuit boards with dot-plating graphics, which can effectively solve the problem that the connection points between the steps of the existing dot-plating graphics and the lines cannot be effectively filled during film sticking, and improve the yield

Method used

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  • A method for manufacturing circuit board with spot plating pattern
  • A method for manufacturing circuit board with spot plating pattern
  • A method for manufacturing circuit board with spot plating pattern

Examples

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Embodiment Construction

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0047]In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific o...

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PUM

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Abstract

The invention discloses a method for manufacturing a circuit board with spot plating graphics, which includes pretreatment, copper sinking treatment, internal light imaging, spot plating, external light imaging and post-processing procedures. The surface of the copper layer, and obtain a rectangular spot plating pattern on the substrate and connect lines between different spot plating patterns; use electroplating to electroplate the spot plating patterns and lines to a preset thickness, and the point plating patterns protrude from the plate. The surface and form a rectangular step; wherein the rolling direction of the pressure roller on the film laminating machine is parallel to the length direction of the step, so that the dry film is located at the connection area where the two ends of the line are connected to the step; It is formed into a regular pattern. When performing secondary film laminating processing, the dry film can be filled at the junction between the dot plating pattern and the line according to the specific film lamination method, which reduces the ease of post-processing of the product at the junction between the dot plating pattern and the line. There is a short circuit problem.

Description

technical field [0001] The invention relates to the technical field of spot plating, in particular to a method for manufacturing a circuit board with spot plating patterns. Background technique [0002] With the rapid development of social economy and the optimization and upgrading of economic structure, it means that a new round of technological revolution and industrial transformation is emerging in the world, which is bound to have a profound impact on the manufacturing industry worldwide. As the basic components of electronic equipment, printed circuit boards are the transmission carriers of current and signals, and play a pivotal role in electronic equipment. Therefore, higher requirements are placed on printed circuit boards. [0003] In order to ensure quality, enhance customer confidence, speed up the development of potential customers, and strive for more market share to seize market opportunities, the process of printed circuit board design is more complicated, and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
CPCH05K3/06
Inventor 刘顺风
Owner 珠海杰赛科技有限公司
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