Bearing plate for wave-soldering device

A carrier board and wave soldering technology, applied in the field of carrier, can solve the problems of unfavorable use, cumbersome repetition, affecting production quality and production efficiency, and achieve the effect of avoiding tin bridges

Inactive Publication Date: 2010-01-27
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it is not only time-consuming, but also cumbersome and repetitive, which reduces work efficiency, and is prone to omissions, resulting in the outflow of defective products, which may damage the company's industrial interests. Therefore, this phenomenon is actually a problem that affects production quality and production efficiency.
[0005] In order to improve the above defects, some solutions have been adopted in the indus

Method used

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  • Bearing plate for wave-soldering device
  • Bearing plate for wave-soldering device
  • Bearing plate for wave-soldering device

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[0029] The following describes the implementation of the present invention through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the spirit of the present invention.

[0030] It should be noted that the carrier board for wave soldering equipment of the present invention is used in wave soldering operations. The circuit board with plug-in components is placed on the carrier board, and then the circuit board is fixed by tools or other fixing methods. It is fixed on the carrier board and can be wave soldered. In addition, the wave soldering operation is suitable for the solderin...

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Abstract

The invention relates to a bearing plate for a wave-soldering device, which is used for bearing a circuit board provided with plug-in components. The bearing plate is provided with a plurality of openings corresponding to the plug-in components, one side close to the openings on the bearing plate is provided with a drip flake structure which passes through one side of the wave-soldering device on the bearing plate, the drip flake structure comprises a fixed part and a metal layer which is arranged on the surface of the fixed part and has drip flake property, and during soldering, the drip flake structure absorbs the redundant soldering tin from the adjacent side of soldering pins of the plug-in components during soldering so as to avoid bad phenomena of tin bridges and the like appearing among the soldering pins.

Description

technical field [0001] The invention relates to a bearing technology applied to wave soldering equipment, in particular to a bearing plate used to absorb excess solder during welding. Background technique [0002] With the advancement of industrial technology, the components on the circuit board are becoming smaller and smaller, so that the spacing of the soldering points is also changed from a large spacing to a small spacing. Especially for some components with multiple soldering feet, such as chips, etc., the number of soldering feet is relatively large and dense, and the distance between the soldering feet is measured in mils, so the distance between each other is equivalent. Therefore, in actual soldering, the problem that multiple soldering pins are easily bonded by solder often occurs. [0003] Generally, when soldering such densely spaced electronic components, wave soldering equipment is used to complete the soldering spot welding. In detail, the wave soldering equ...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 蔡小明章世官薛其瑞
Owner INVENTEC CORP
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