Bearing plate for wave-soldering device

A carrier board and wave soldering technology, applied in the field of carrier, can solve the problems of unfavorable use, cumbersome repetition, affecting production quality and production efficiency, and achieve the effect of avoiding tin bridges
CN101636045AInactive Publication Date: 2010-01-27INVENTEC CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
INVENTEC CORP
Publication Date
2010-01-27
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a bearing plate for a wave-soldering device, which is used for bearing a circuit board provided with plug-in components. The bearing plate is provided with a plurality of openings corresponding to the plug-in components, one side close to the openings on the bearing plate is provided with a drip flake structure which passes through one side of the wave-soldering device on the bearing plate, the drip flake structure comprises a fixed part and a metal layer which is arranged on the surface of the fixed part and has drip flake property, and during soldering, the drip flake structure absorbs the redundant soldering tin from the adjacent side of soldering pins of the plug-in components during soldering so as to avoid bad phenomena of tin bridges and the like appearing among the soldering pins.
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Description

technical field

[0001] The invention relates to a bearing technology applied to wave soldering equipment, in particular to a bearing plate used to absorb excess solder during welding. Background technique

[0002] With the advancement of industrial technology, the components on the circuit board are becoming smaller and smaller, so that the spacing of the soldering points is also changed from a large spacing to a small spacing. Especially for some components with multiple soldering feet, such as chips, etc., the number of soldering feet is relatively large and dense, and the distance between the soldering feet is measured in mils, so the distance between each other is equivalent. Therefore, in actual soldering, the problem that multiple soldering pins are easily bonded by solder often occurs.

[0003] Generally, when soldering such densely spaced electronic components, wave soldering equipment is used to complete the soldering spot welding. In detail, the wave soldering equ...

Claims

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