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A method of making a stepped groove

A manufacturing method and a stepped groove technology, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve problems such as electrical function failure, achieve the effects of ensuring processing quality, reducing manufacturing difficulty, and strong versatility

Active Publication Date: 2021-01-05
DONGGUAN SHENGYI ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method has great restrictions on the design, requiring that the multiple slot bottom lines extending outside the slot must be the same network, otherwise different networks will be conducted through the side wall copper layer, resulting in electrical function failure

Method used

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  • A method of making a stepped groove
  • A method of making a stepped groove
  • A method of making a stepped groove

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Embodiment Construction

[0045] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] see Figure 6 and Figure 7 , the manufacturing method of the stepped groove proposed in this embodiment specifically includes the following steps:

[0047] Step 101: According to the preset stacking sequence, for the first core board located in the specified layer, perform inner layer circuit pattern making, and make the metal l...

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Abstract

The invention relates to the technical field of PCBs, and discloses a manufacturing method of a stepped groove. The method comprises the following steps: manufacturing a metal layer covering a presetslotting area and a specified width on a periphery on a first core plate positioned on a specified layer; manufacturing an anti-electroplating soft material layer on a surface of the metal layer; laminating the first core plate, a bottom core plate, prepregs and other core plates to form a multilayer plate; carrying out depth-controlled milling operation and wedge-shaped machining operation to manufacture the stepped groove with a non-metallized side wall, enabling the stepped groove to penetrate through the metal layer and the soft material layer on the specified layer, and enabling the metallayer to deform to an oriented wedge-shaped structure so as to cover an exposed area of the soft material layer on a side wall; depositing a conductive layer, and then removing the metal layer covering the soft material layer to expose the soft material layer; and electroplating. In the invention, disconnection between a side wall copper layer and a groove bottom circuit pattern is realized, manufacturing difficulty is greatly reduced, and processing quality can be effectively ensured; and the manufacturing of the groove bottom pattern is not limited, and universality is high.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a stepped groove. Background technique [0002] In order to facilitate the installation of devices with special functions or devices that need to be sunken on the PCB, it is often necessary to set stepped grooves on the PCB. The stepped grooves are also an important part of realizing high-power heat dissipation of products and are widely used in the industry. The side walls of the stepped grooves can be metallized or non-metallized. [0003] For stepped grooves with side wall metallization, under the production requirements of the network connection between the bottom line and the line outside the groove, via holes are usually made at the bottom of the groove, and the network connection is realized through the via holes, such as figure 1 shown. However, this method is indirect conduction, and via holes must b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4697
Inventor 焦其正王小平王洪府纪成光
Owner DONGGUAN SHENGYI ELECTRONICS
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