Waterproof air pressure sensor and manufacturing method thereof
A technology of air pressure sensor and manufacturing method, which is applied in the direction of instruments, measuring fluid pressure, measuring devices, etc., can solve the problems of unstable performance of waterproof air pressure sensor, performance deviation of waterproof air pressure sensor, and influence on stress distribution in glue, etc., to achieve improvement Large amount of residual air bubbles, reduced glue thickness, and reduced influence
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0033] figure 1 It is a schematic structural diagram of the waterproof air pressure sensor according to Embodiment 1 of the present invention.
[0034] like figure 1 As shown, the waterproof air pressure sensor proposed in this embodiment. Aiming at the problem that the filling of elastic waterproof glue is prone to residual air bubbles and the residual air bubbles affect the performance of the sensor, an improvement is made on the basis of the existing waterproof air pressure sensor packaging structure.
[0035] Specifically, the waterproof air pressure sensor provided in this embodiment includes a casing 101 and a substrate 102. The casing 101 is fixed above the substrate 102 and forms a receiving space with the substrate 102. A chip 107 is provided above the substrate 102 in the receiving space. The space is filled with hard glue 105 and elastic waterproof glue 104 , and the elastic waterproof glue 104 is filled in the accommodation space above the upper end surface of ...
Embodiment 2
[0045] figure 2 It is a schematic structural diagram of a waterproof air pressure sensor according to Embodiment 2 of the present invention.
[0046] like figure 2 As shown, the waterproof air pressure sensor proposed in this embodiment, on the basis of Embodiment 1, is filled with elastic waterproof glue 104 in the receiving space just above the sensing diaphragm on the upper end face of the chip 103, so that the shape of the elastic waterproof glue 104 is cylindrical , the hard glue 105 is filled around the chip 103 and the space other than the elastic waterproof glue 104 .
[0047] The processing technology process of the present embodiment:
[0048]The chip 103 is first fixed on the substrate 102, metal wire bonding is performed, and then the metal casing 101 is bonded and fixed, and then the hard glue 105 is filled, and the hard glue 105 is canned on the chip 103. In the accommodating space, the hard glue 105 is defoamed and cured, and finally the elastic waterproof ...
Embodiment 3
[0050] image 3 It is a schematic structural diagram of the waterproof air pressure sensor according to Embodiment 3 of the present invention.
[0051] like image 3 As shown, the waterproof air pressure sensor proposed in this embodiment, on the basis of Embodiment 1, is filled with elastic waterproof glue 104 in the receiving space directly above and diagonally above the sensing diaphragm on the upper end face of the chip 103, so that the shape of the elastic waterproof glue 104 is In a table shape, the hard glue 105 is filled around the chip 103 and the space other than the elastic waterproof glue 104 .
[0052] The processing technology process of the present embodiment:
[0053] The chip 103 is first fixed on the substrate 102, metal wire bonding is performed, and then the metal casing 101 is bonded and fixed, and then the hard glue 105 is filled, and the hard glue 105 is canned on the top of the chip 103. In the storage space other than the diagonally above, the hard ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| hardness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


