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Waterproof air pressure sensor and manufacturing method thereof

A technology of air pressure sensor and manufacturing method, which is applied in the direction of instruments, measuring fluid pressure, measuring devices, etc., can solve the problems of unstable performance of waterproof air pressure sensor, performance deviation of waterproof air pressure sensor, and influence on stress distribution in glue, etc., to achieve improvement Large amount of residual air bubbles, reduced glue thickness, and reduced influence

Active Publication Date: 2022-06-17
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] After completing all the packaging and testing processes of the waterproof air pressure sensor, that is, after the finished product is made, because the silicone gel is very soft, when the ambient temperature changes, the residual bubbles will expand or shrink, causing the silicone gel near the bubbles to deform, and even the chip Changes in the thickness of the upper colloid will affect the distribution of stress in the colloid, which will cause the performance of the waterproof air pressure sensor to shift, resulting in unstable performance of the waterproof air pressure sensor

Method used

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  • Waterproof air pressure sensor and manufacturing method thereof
  • Waterproof air pressure sensor and manufacturing method thereof
  • Waterproof air pressure sensor and manufacturing method thereof

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Embodiment 1

[0033] figure 1 It is a schematic structural diagram of the waterproof air pressure sensor according to Embodiment 1 of the present invention.

[0034] like figure 1 As shown, the waterproof air pressure sensor proposed in this embodiment. Aiming at the problem that the filling of elastic waterproof glue is prone to residual air bubbles and the residual air bubbles affect the performance of the sensor, an improvement is made on the basis of the existing waterproof air pressure sensor packaging structure.

[0035] Specifically, the waterproof air pressure sensor provided in this embodiment includes a casing 101 and a substrate 102. The casing 101 is fixed above the substrate 102 and forms a receiving space with the substrate 102. A chip 107 is provided above the substrate 102 in the receiving space. The space is filled with hard glue 105 and elastic waterproof glue 104 , and the elastic waterproof glue 104 is filled in the accommodation space above the upper end surface of ...

Embodiment 2

[0045] figure 2 It is a schematic structural diagram of a waterproof air pressure sensor according to Embodiment 2 of the present invention.

[0046] like figure 2 As shown, the waterproof air pressure sensor proposed in this embodiment, on the basis of Embodiment 1, is filled with elastic waterproof glue 104 in the receiving space just above the sensing diaphragm on the upper end face of the chip 103, so that the shape of the elastic waterproof glue 104 is cylindrical , the hard glue 105 is filled around the chip 103 and the space other than the elastic waterproof glue 104 .

[0047] The processing technology process of the present embodiment:

[0048]The chip 103 is first fixed on the substrate 102, metal wire bonding is performed, and then the metal casing 101 is bonded and fixed, and then the hard glue 105 is filled, and the hard glue 105 is canned on the chip 103. In the accommodating space, the hard glue 105 is defoamed and cured, and finally the elastic waterproof ...

Embodiment 3

[0050] image 3 It is a schematic structural diagram of the waterproof air pressure sensor according to Embodiment 3 of the present invention.

[0051] like image 3 As shown, the waterproof air pressure sensor proposed in this embodiment, on the basis of Embodiment 1, is filled with elastic waterproof glue 104 in the receiving space directly above and diagonally above the sensing diaphragm on the upper end face of the chip 103, so that the shape of the elastic waterproof glue 104 is In a table shape, the hard glue 105 is filled around the chip 103 and the space other than the elastic waterproof glue 104 .

[0052] The processing technology process of the present embodiment:

[0053] The chip 103 is first fixed on the substrate 102, metal wire bonding is performed, and then the metal casing 101 is bonded and fixed, and then the hard glue 105 is filled, and the hard glue 105 is canned on the top of the chip 103. In the storage space other than the diagonally above, the hard ...

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Abstract

The invention provides a waterproof air pressure sensor and a manufacturing method thereof. The waterproof air pressure sensor includes a casing and a substrate. The casing is fixed above the substrate and forms a storage space with the substrate. A chip is arranged above the substrate in the storage space. Elastic waterproof glue It is filled in the storage space above the end surface of the chip, and the hard glue is filled in the storage space other than the elastic waterproof glue. In the present invention, the filling volume and glue thickness of the elastic waterproof glue are greatly reduced, which improves the shortcoming of only using the elastic waterproof glue to fill the interior with a large amount of residual air bubbles, and stabilizes the performance of the waterproof air pressure sensor.

Description

technical field [0001] The present invention relates to the technical field of air pressure sensors, and more particularly, to a waterproof air pressure sensor and a manufacturing method thereof. Background technique [0002] Most of the existing waterproof air pressure sensors, by filling the sensor with elastic silicone gel, can usually reach 50m to 100m waterproof, and the range (pressure measurement range) can reach 30kPa to 150kPa. In addition to measuring atmospheric pressure, the waterproof air pressure sensor can also measure a certain water pressure / depth. [0003] Figure 4 It is a schematic structural diagram of the packaging structure of the waterproof air pressure sensor in the prior art. like Figure 4 As shown, the existing waterproof air pressure sensor package structure generally includes a casing 101 and a substrate 102, the casing 101 is fixed above the substrate 102 and forms a receiving space with the substrate 102, and a chip 103 is fixed above the sub...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L19/06G01L19/14
CPCG01L19/0654G01L19/148
Inventor 巩向辉付博方华斌
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD