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Earphone and head-mounted device

A technology for earphones and face covers, which is applied in earpiece/earphone accessories, earphone manufacturing/assembly, on-ear/over-ear earphones, etc. It can solve the problems of poor touch feeling, poor appearance, and poor plastic strength, etc., to achieve Improve sensitivity and stability, facilitate deformation, and improve strength

Inactive Publication Date: 2020-04-17
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, plastics have disadvantages such as poor strength, poor appearance and high-end metal parts, and poor touch feel.

Method used

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  • Earphone and head-mounted device
  • Earphone and head-mounted device
  • Earphone and head-mounted device

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Experimental program
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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0034] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0035] At the same time,...

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PUM

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Abstract

The invention discloses an earphone and a head-mounted device, and the earphone comprises a housing which is provided with an installation groove; and a touch assembly which comprises a surface covercovering a groove opening of the installation groove and a touch circuit board, wherein a step is arranged on the side, facing the bottom wall of the installation groove, of the surface cover in a protruding mode; the touch circuit board is arranged in the mounting groove and connected with the step, and a gap is formed between the touch circuit board and the surface cover. According to the earphone adopting the metal surface cover to achieve touch control, the touch control can be achieved through the metal surface cover; meanwhile, the touch control circuit is not damaged or affected, and apoint contact area is not affected.

Description

technical field [0001] The invention relates to the field of smart earphone technology, in particular to an earphone and a head-mounted device using the earphone. Background technique [0002] The touch function of the existing bluetooth headset usually adopts plastic microscopic deformation to transmit signals to the touch control chip, and then feedbacks to realize various functions of touch operation. However, plastics have disadvantages such as poor strength, poor appearance and high-end metal parts, and poor touch feel. [0003] The above is only used to assist the understanding of the technical solution of the present application, and does not mean that it is recognized as the prior art. Contents of the invention [0004] The main purpose of the present invention is to provide an earphone and a head-mounted device, aiming to provide an earphone that uses a metal cover to realize touch control. The earphone can realize touch control through the metal cover without da...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1008H04R1/1066H04R1/1091
Inventor 张亚雄宋坤
Owner GEER TECH CO LTD